SLUSF51C March   2023  – January 2024 TPSM863252 , TPSM863253 , TPSM863257

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Family Devices
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Operation and D-CAP3™ Control Mode
      2. 7.3.2 Eco-mode Control
      3. 7.3.3 Soft Start and Prebiased Soft Start
      4. 7.3.4 Overvoltage Protection
      5. 7.3.5 Frequency
      6. 7.3.6 Large Duty Operation
      7. 7.3.7 Current Protection and Undervoltage Protection
      8. 7.3.8 Undervoltage Lockout (UVLO) Protection
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Eco-mode Operation
      2. 7.4.2 FCCM Mode Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design with WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Resistors Selection
        3. 8.2.2.3 Output Filter Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Enable Circuit
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Custom Design with WEBENCH® Tools
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

  • Make sure the VIN and GND traces are as wide as possible to reduce trace impedance. The wide areas are also an advantage from the view point of heat dissipation.
  • Place the input capacitor and output capacitor as close to the device as possible to minimize trace impedance.
  • Provide sufficient vias for the input capacitor and output capacitor.
  • Connect a separate VOUT path to the upper feedback resistor.
  • Place a voltage feedback loop away from the high-voltage switching trace, and preferably has ground shield.
  • Make sure the trace of the FB node is as small as possible to avoid noise coupling.
  • Make sure the GND trace between the output capacitor and the GND pin are as wide as possible to minimize the trace impedance.