SLUSF51C March   2023  – January 2024 TPSM863252 , TPSM863253 , TPSM863257

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Family Devices
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Operation and D-CAP3™ Control Mode
      2. 7.3.2 Eco-mode Control
      3. 7.3.3 Soft Start and Prebiased Soft Start
      4. 7.3.4 Overvoltage Protection
      5. 7.3.5 Frequency
      6. 7.3.6 Large Duty Operation
      7. 7.3.7 Current Protection and Undervoltage Protection
      8. 7.3.8 Undervoltage Lockout (UVLO) Protection
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Eco-mode Operation
      2. 7.4.2 FCCM Mode Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design with WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Resistors Selection
        3. 8.2.2.3 Output Filter Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Enable Circuit
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Custom Design with WEBENCH® Tools
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPSM86325x UNIT
RDX
7 PINS
RθJA Junction-to-ambient thermal resistance 61.3 °C/W
RθJA_effective Junction-to-ambient thermal resistance on EVM board 40(2) °C/W
RθJC(top) Junction-to-case (top) thermal resistance 60.8 °C/W
RθJB Junction-to-board thermal resistance 20.0 °C/W
ΨJT Junction-to-top characterization parameter 7.5 °C/W
ΨJB Junction-to-board characterization parameter 19.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) This RθJA_effective is tested on TPSM863252EVM board (4 layer board, copper thickness of top and bottom layer are 2oz, and copper thickness of internal GND is 1oz) at Vin = 12V, Vout = 5V, Iout = 3A , TA = 25oC.