TPSM8S6C24 is a highly integrated, easy-to-use, non-isolated DC/DC buck power module with added manufacturer-specific PMBus commands and the addition of EXTENDED_WRITE_PROTECT and PASSKEY improves security against malicious access to the PMBus by restricting Write capability with greater resolution than the standard Write Protect command.
TPSM8S6C24 is a 35-A power module and can source up to 140-A with 4 × stackability. The device has an option to overdrive the internal 5-V LDO with an external 5-V supply to enable lower input voltage range down to 2.95 V and improve the efficiency of the converter.
TPSM8S6C24 power module uses a proprietary fixed-frequency current-mode control with input feedforward and selectable internal compensation components for minimal size and stability over a wide range of output capacitances.
PART NUMBER | PACKAGE(1) | PACKAGE SIZE (NOM)(2) |
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TPSM8S6C24 | MOY (QFM, 45) | 16.00 mm × 11.00 mm |
DATE | REVISION | NOTES |
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august 2023 | * | Initial Release |
The PMBus interface with 1-MHz clock support to provide a convenient, standardized digital interface for converter configuration as well as monitoring of key parameters including output voltage, output current, and internal die temperature. Response to fault conditions can be set to restart, latch off, or ignore, depending on system requirements. Back-channel communication between stacked devices enables all TPSM8S6C24 converters, powering a single output rail to share a single address to simplify system software/firmware design. Key parameters including output voltage, switching frequency, soft-start time, and overcurrent fault limits can also be configured through BOM selection without PMBus communication to support program free power up.
PIN | I/O | DESCRIPTION | |
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NAME | NO. | ||
PGND | 1, 4, 17, 23, 39, 42, 44 | — | Power stage ground return. Pins 42 and 44 also act as the thermal pad of the device. |
VOSNS | 2 | I | The positive input of the remote sense amplifier. For a standalone device or a loop controller device in a multi-phase configuration, connect the VOSNS pin to the output voltage at the load. For the loop follower device in a multi-phase configuration, the remote sense amplifier is not required for output voltage sensing or regulation and this pin can be left floating. If used to monitor another voltage with the Phased READ_VOUT command, VOSNS must be maintained between 0 V and 0.75 V with a < 1-kΩ resistor divider due to the internal resistance to GOSNS, which is connected to BP1V5. |
GOSNS/FLWR | 3 | I | The negative input of the remote sense amplifier for a loop controller device or pull up high to indicate loop follower. For a standalone device or a loop controller device in a multi-phase configuration, connect the GOSNS pin to the ground at the load. For the loop follower device in a multi-phase configuration, the GOSNS pin must be pulled up to BP1V5 to indicate the device is a loop follower. |
BP1V5 | 5 | O | Output of the 1.5-V internal regulator for MSEL,VSEL, and ADRSEL pins. No external bypassing required. Not designed to power other circuits. |
SMB_ALRT | 6 | O | SMBus alert pin. See SMBus specification. |
PMB_CLK | 7 | I | PMBus CLK pin. See the Current PMBus Specifications. |
PMB_DATA | 8 | I/O | PMBus DATA pin. See the Current PMBus Specifications. |
PGD/RST | 9 | I/O | Open-drain power good or (21h) VOUT_COMMAND RESET#. As determined by user-programmable RESET# bit in (EDh) MFR_SPECIFIC_29 (MISC_OPTIONS). The default pin function is an open-drain power-good indicator. When configured as RESET#, an internal pullup can be enabled or disabled by the PULLUP# bit in (EDh) MFR_SPECIFIC_29 (MISC_OPTIONS). |
BCX_DATA | 10 | I/O | Data for back-channel communications between stacked devices |
BCX_CLK | 11 | I/O | Clock for back-channel communications between stacked devices |
VSHARE | 12 | I/O | Voltage sharing signal for multi-phase operation. For a standalone device, the VSHARE pin must be left floating. VSHARE can be bypassed to AGND with up to 50 pF of capacitance. |
MSEL1 | 13 | I | Connect this pin to a 1% tolerence or better resistor divider between BP1V5and AGND for different options of switching frequency and internal compensation parameters. See Programming MSEL1. |
ADRSEL | 14 | I | Connect this pin to a 1% tolerance or better resistor divider between BP1V5 and AGND for different options of PMBus addresses and frequency sync (including determination of SYNC pin as SYNCIN or SYNCOUT function). See Programming ADRSEL. |
VSEL | 15 | I | Connect this pin to a 1% tolerence or better resistor divider between BP1V5 and AGND for different options of internal voltage feedback dividers and default output voltage. See Programming VSEL. |
MSEL2 | 16 | I | Connect this pin to a 1% tolerence or better resistor divider between BP1V5 and AGND for different options of soft-start time, overcurrent fault limit, and multiphase information. See Programming MSEL2 or Programming MSEL2 for a Loop Follower Device (GOSNS Tied to BP1V5) for a loop follower device GOSNS tied to BP1V5. |
EN/UVLO | 19 | I | Enable switching as the PMBus CONTROL pin. EN/UVLO can also be connected to a resistor divider to program input voltage UVLO. |
PVIN | 18,45 | I | Input power to the power stage. Low-impedance bypassing of these pins to PGND is critical. PVIN to PGND must be bypassed with X5R or better ceramic capacitors rated for at least 1.5x the maximum PVIN voltage. |
AVIN | 20 | I | Input power to the controller |
AGND | 21 | — | Analog ground return for controller. Connect the AGND pin directly to the thermal pad on the PCB board. |
VDD5 | 22 | O | Output of the 5-V internal regulator. A bypassing capacitor is integrated and no external bypassing is required. |
SYNC | 28 | I/O | For frequency synchronization, this pin can be programmed as SYNC IN or SYNC OUT pin by the ADRSEL pin or the (E4h) MFR_SPECIFIC_20 (SYNC_CONFIG) PMBus command. SYNC pin can be left floating when not used. |
VOUT | 40, 41 | O | Output of power module. Connect to output bypass capacitors to this pin. |
Thermal Pad | 42, 44 | — | The thermal pad is the PGND pin made with a large area of copper to improve thermal conductivity to PCB. The thermal pad must have adequate solder coverage for best thermal performance. |
SW | 43 | I/O | Switched power output of the device. Connect the output averaging filter and bootstrap to this group of pins if needed. |
NC | 24, 25, 26, 27, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38 | — | No Connection |