SLUSF73
august 2023
TPSM8S6C24
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Revision History
5
Description (continued)
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Average Current-Mode Control
8.3.1.1
On-Time Modulator
8.3.1.2
Current Error Integrator
8.3.1.3
Voltage Error Integrator
8.3.2
Linear Regulators
8.3.3
AVIN and PVIN Pins
8.3.4
Input Undervoltage Lockout (UVLO)
8.3.4.1
Fixed AVIN UVLO
8.3.4.2
Fixed VDD5 UVLO
8.3.4.3
Programmable PVIN UVLO
8.3.4.4
EN/UVLO Pin
8.3.5
Start-Up and Shutdown
8.3.6
Differential Sense Amplifier and Feedback Divider
8.3.7
Set Output Voltage and Adaptive Voltage Scaling (AVS)
8.3.7.1
Reset Output Voltage
8.3.7.2
Soft Start
8.3.8
Prebiased Output Start-Up
8.3.9
Soft Stop and (65h) TOFF_FALL Command
8.3.10
Power Good (PGOOD)
8.3.11
Set Switching Frequency
8.3.12
Frequency Synchronization
8.3.13
Loop Follower Detection
8.3.14
Current Sensing and Sharing
8.3.15
Telemetry
8.3.16
Overcurrent Protection
8.3.17
Overvoltage, Undervoltage Protection
8.3.18
Overtemperature Management
8.3.19
Fault Management
8.3.20
Back-Channel Communication
8.3.21
Switching Node (SW)
8.3.22
PMBus General Description
8.3.23
PMBus Address
8.3.24
PMBus Connections
8.4
Device Functional Modes
8.4.1
Programming Mode
8.4.2
Standalone, Loop Controller, Loop Follower Mode Pin Connections
8.4.3
Continuous Conduction Mode
8.4.4
Operation With CNTL Signal (EN/UVLO)
8.4.5
Operation with (01h) OPERATION Control
8.4.6
Operation with CNTL and (01h) OPERATION Control
8.5
Programming
8.5.1
Supported PMBus Commands
8.5.2
Pin Strapping
8.5.2.1
Programming MSEL1
8.5.2.2
Programming MSEL2
8.5.2.3
Programming VSEL
8.5.2.4
Programming ADRSEL
8.5.2.5
Programming MSEL2 for a Loop Follower Device (GOSNS Tied to BP1V5)
8.5.2.6
Pin-Strapping Resistor Configuration
8.6
Register Maps
8.6.1
Conventions for Documenting Block Commands
8.6.2
(01h) OPERATION
8.6.3
(02h) ON_OFF_CONFIG
8.6.4
(03h) CLEAR_FAULTS
8.6.5
(04h) PHASE
8.6.6
(10h) WRITE_PROTECT
8.6.7
(15h) STORE_USER_ALL
8.6.8
(16h) RESTORE_USER_ALL
8.6.9
(19h) CAPABILITY
8.6.10
(1Bh) SMBALERT_MASK
8.6.11
(1Bh) SMBALERT_MASK_VOUT
8.6.12
(1Bh) SMBALERT_MASK_IOUT
8.6.13
(1Bh) SMBALERT_MASK_INPUT
8.6.14
(1Bh) SMBALERT_MASK_TEMPERATURE
8.6.15
(1Bh) SMBALERT_MASK_CML
8.6.16
(1Bh) SMBALERT_MASK_OTHER
8.6.17
(1Bh) SMBALERT_MASK_MFR
8.6.18
(20h) VOUT_MODE
8.6.19
(21h) VOUT_COMMAND
8.6.20
(22h) VOUT_TRIM
8.6.21
(24h) VOUT_MAX
8.6.22
(25h) VOUT_MARGIN_HIGH
8.6.23
(26h) VOUT_MARGIN_LOW
8.6.24
(27h) VOUT_TRANSITION_RATE
8.6.25
(29h) VOUT_SCALE_LOOP
8.6.26
(2Bh) VOUT_MIN
8.6.27
(33h) FREQUENCY_SWITCH
8.6.28
(35h) VIN_ON
8.6.29
(36h) VIN_OFF
8.6.30
(37h) INTERLEAVE
8.6.31
(38h) IOUT_CAL_GAIN
8.6.32
(39h) IOUT_CAL_OFFSET
8.6.33
(40h) VOUT_OV_FAULT_LIMIT
8.6.34
(41h) VOUT_OV_FAULT_RESPONSE
8.6.35
(42h) VOUT_OV_WARN_LIMIT
8.6.36
(43h) VOUT_UV_WARN_LIMIT
8.6.37
(44h) VOUT_UV_FAULT_LIMIT
8.6.38
(45h) VOUT_UV_FAULT_RESPONSE
8.6.39
(46h) IOUT_OC_FAULT_LIMIT
8.6.40
(47h) IOUT_OC_FAULT_RESPONSE
8.6.41
(4Ah) IOUT_OC_WARN_LIMIT
8.6.42
(4Fh) OT_FAULT_LIMIT
8.6.43
(50h) OT_FAULT_RESPONSE
8.6.44
(51h) OT_WARN_LIMIT
8.6.45
(55h) VIN_OV_FAULT_LIMIT
8.6.46
(56h) VIN_OV_FAULT_RESPONSE
8.6.47
(58h) VIN_UV_WARN_LIMIT
8.6.48
(60h) TON_DELAY
8.6.49
(61h) TON_RISE
8.6.50
(62h) TON_MAX_FAULT_LIMIT
8.6.51
(63h) TON_MAX_FAULT_RESPONSE
8.6.52
(64h) TOFF_DELAY
8.6.53
(65h) TOFF_FALL
8.6.54
(78h) STATUS_BYTE
8.6.55
(79h) STATUS_WORD
8.6.56
(7Ah) STATUS_VOUT
8.6.57
(7Bh) STATUS_IOUT
8.6.58
(7Ch) STATUS_INPUT
8.6.59
(7Dh) STATUS_TEMPERATURE
8.6.60
(7Eh) STATUS_CML
8.6.61
(7Fh) STATUS_OTHER
8.6.62
(80h) STATUS_MFR_SPECIFIC
8.6.63
(88h) READ_VIN
8.6.64
(8Bh) READ_VOUT
8.6.65
(8Ch) READ_IOUT
8.6.66
(8Dh) READ_TEMPERATURE_1
8.6.67
(98h) PMBUS_REVISION
8.6.68
(99h) MFR_ID
8.6.69
(9Ah) MFR_MODEL
8.6.70
(9Bh) MFR_REVISION
8.6.71
(9Eh) MFR_SERIAL
8.6.72
(ADh) IC_DEVICE_ID
8.6.73
(AEh) IC_DEVICE_REV
8.6.74
(B1h) USER_DATA_01 (COMPENSATION_CONFIG)
8.6.75
(B5h) USER_DATA_05 (POWER_STAGE_CONFIG)
8.6.76
(D0h) MFR_SPECIFIC_00 (TELEMETRY_CONFIG)
8.6.77
(DAh) MFR_SPECIFIC_10 (READ_ALL)
8.6.78
(DBh) MFR_SPECIFIC_11 (STATUS_ALL)
8.6.79
(DCh) MFR_SPECIFIC_12 (STATUS_PHASE)
8.6.80
(E3h) MFR_SPECIFIC_19 (PGOOD_CONFIG)
8.6.81
(E4h) MFR_SPECIFIC_20 (SYNC_CONFIG)
8.6.82
(ECh) MFR_SPECIFIC_28 (STACK_CONFIG)
8.6.83
(EDh) MFR_SPECIFIC_29 (MISC_OPTIONS)
8.6.84
(EEh) MFR_SPECIFIC_30 (PIN_DETECT_OVERRIDE)
8.6.85
(EFh) MFR_SPECIFIC_31 (DEVICE_ADDRESS)
8.6.86
(F0h) MFR_SPECIFIC_32 (NVM_CHECKSUM)
8.6.87
(F1h) MFR_SPECIFIC_33 (SIMULATE_FAULT)
8.6.88
(FAh) MFR_SPECIFIC_42 (PASSKEY)
8.6.89
(FBh) MFR_SPECIFIC_43 (EXT_WRITE_PROTECT)
8.6.90
(FCh) MFR_SPECIFIC_44 (FUSION_ID0)
8.6.91
(FDh) MFR_SPECIFIC_45 (FUSION_ID1)
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Custom Design With WEBENCH® Tools
9.2.2.2
Switching Frequency
9.2.2.3
Output Voltage Setting (VSEL Pin)
9.2.2.4
Compensation Selection (MSEL1 Pin)
9.2.2.5
Output Capacitor Selection
9.2.2.5.1
Output Voltage Ripple
9.2.2.6
Input Capacitor Selection
9.2.2.7
Soft Start, Overcurrent Protection, and Stacking Configuration (MSEL2 Pin)
9.2.2.8
Enable and UVLO
9.2.2.9
ADRSEL
9.2.2.10
BCX_CLK and BCX_DAT
9.2.3
Application Curves
9.2.4
Two-Phase Application
9.2.4.1
Design Requirements
9.2.4.2
Two-Phase Detailed Design Procedure
9.2.4.2.1
Switching Frequency
9.2.4.2.2
Output Voltage Setting (VSEL Pin)
9.2.4.2.3
Compensation Selection (MSEL1 Pin)
9.2.4.2.4
Output Capacitor Selection
9.2.4.2.5
Input Capacitor Selection
9.2.4.2.6
GOSNS/Loop Follower Pin of Loop Follower Devices
9.2.4.2.7
Soft Start, Overcurrent Protection, and Stacking Configuration (MSEL2 Pin)
9.2.4.2.8
Enable, UVLO
9.2.4.2.9
VSHARE Pin
9.2.4.2.9.1
ADRSEL Pin
9.2.4.2.10
SYNC Pin
9.2.4.2.11
VOSNS Pin of Loop Follower Devices
9.2.4.2.12
Unused Pins of Loop Follower Devices
9.2.4.3
Two-Phase Application Curves
9.3
Power Supply Recommendations
9.4
Layout
9.4.1
Layout Guidelines
9.4.2
Layout Example
9.4.2.1
Thermal Performance on the TI EVM
9.4.2.2
EMI
10
Device and Documentation Support
10.1
Device Support
10.1.1
Third-Party Products Disclaimer
10.1.2
Development Support
10.1.2.1
Texas Instruments Fusion Digital Power Designer
10.1.2.2
Custom Design With WEBENCH® Tools
10.2
Receiving Notification of Documentation Updates
10.3
Support Resources
10.4
Trademarks
10.5
Electrostatic Discharge Caution
10.6
Glossary
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
MOY|45
MPQF759
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slusf73_oa
slusf73_pm
10.6
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.