SBOSA52B november   2022  – august 2023 TRF0206-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Quality Conformance Inspection
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Differential Amplifier
      2. 7.3.2 Single-Supply Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Down Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Driving a High-Speed ADC
      2. 8.1.2 Calculating Output Voltage Swing
      3. 8.1.3 Thermal Considerations
    2. 8.2 Typical Application
      1. 8.2.1 TRF0206-SP Driving an AFE7950-SP Receiver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TRF0206-SP is a very high-performance, radiation-hardened radio-frequency (RF) amplifier optimized for RF applications. This device is an excellent choice for ac-coupled applications that require a single-ended to differential conversion when driving an analog-to-digital converter (ADC) such as the high performance ADC12DJ3200QML-SP. The on-chip matching components simplify printed circuit board (PCB) implementation and provide the highest performance over the usable bandwidth. The device is fabricated using Texas Instruments’ advanced complementary BiCMOS process, and is available in a space-qualified, LCCC package.

The device operates on a 3.3‑V single-rail supply. A power-down feature is available for power savings.

Device Information
PART NUMBER(1) GRADE BODY SIZE(2)
5962R2122001VXC QMLV-RHA FFM (LCCC, 12-pin)
6.2 mm × 6.1 mm
TRF0206FFM/EM Engineering samples(3)
TRF0206EVM Ceramic evaluation board —
(1) For all available packages, see the orderable addendum at the end of the data sheet.
(2) The body size (length × width) is a nominal value and does not include pins.
(3) These units are intended for engineering evaluation only. These samples are processed to a non-compliant flow. These units are not for qualification, production, radiation testing, or flight use. Parts are not warranted for performance over the full MIL specified temperature range, or operating life.
GUID-20220302-SS0I-9HN1-8RM5-SDVPCXDFJ9MS-low.svg TRF0206-SP Driving a High-Speed ADC