SBOSAA3 July   2024 TRF1108

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 AC-Coupled Configuration
      2. 6.3.2 DC-Coupled Configuration
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power-Down Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Thermal Considerations
    2. 7.2 Typical Application
      1. 7.2.1 RF DAC Buffer Amplifier
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Single-Supply Operation
      2. 7.3.2 Dual-Supply Operation
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RPV|12
Thermal pad, mechanical data (Package|Pins)

7.4.1 Layout Guidelines

The TRF1108 is a wide-band feedback amplifier with approximately 15.5dB of gain. When designing with a wide-band RF amplifier with relatively high gain, follow these printed circuit board (PCB) layout guidelines to maintain stability and optimized performance:

  • Use a multilayer board to maintain signal and power integrity, and thermal performance. The figures in the next section show an example of a good layout.
  • Route the RF input and output lines as grounded coplanar waveguide (GCPW) lines. For the second layer, use a continuous ground polygon below the RF traces, and continuous VSS polygon below the amplifier area.
  • Match the input differential lines in length to minimize phase imbalance.
  • Use small-footprint, passive components wherever possible.
  • Connect the ground and VSS planes on the top and internal layers with well stitched vias.
  • Place a thermal via under the device that connects the top thermal pad with VSS planes in the inner layers of PCB. Also, connect the thermal pad to the top layer VSS plane through the VSS pins for improved heat dissipation.