SLLS790E June   2007  – December 2024 TRS3232E

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings - IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics — Device
    7. 5.7 Electrical Characteristics — Driver
    8. 5.8 Electrical Characteristics — Receiver
    9. 5.9 Switching Characteristics
    10.     Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power
      2. 7.3.2 RS232 Driver
      3. 7.3.3 RS232 Receiver
    4. 7.4 Device Functional Modes
      1. 7.4.1 VCC Powered by 3V to 5.5V
      2. 7.4.2 VCC Unpowered, VCC = 0V
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision D (June 2021) to Revision E (December 2024)

  • Changed the Device Information table to the Package Information tableGo
  • Added the SOT-23-THN (DYY) package to the data sheetGo
  • Added Note 2 to the ESD ratings - IEC Specifications Go

Changes from Revision C (June 2021) to Revision D (June 2021)

  • Added Applications: Industrial PCs, Wired networking, and Data center and enterprise computingGo
  • Changed the table note in the ESD Ratings - IEC Specifications to make it applicable to D, DB and PW packages. Go
  • Changed the thermal parameter values for D, DB and PW packages in the Thermal Information tableGo

Changes from Revision B (October 2017) to Revision C (June 2021)

  • Added RGT package to the Device Information Go
  • Added the RGT Pin Configuration Go
  • Added the ESD Ratings - IEC Specifications Go
  • Added RGT to the Thermal Information Go
  • Added RGT package to the Switching Characteristics Go
  • Changed the capacitor value From: 1 µf To: 0.1 µf in the Layout Diagram Go

Changes from Revision A (July 2015) to Revision B (October 2017)

  • Added Feature: Interoperable with RS-232 down to 2.7-V VCC Go
  • Added Figure 5-3 Go

Changes from Revision * (April 2007) to Revision A (July 2015)

  • Deleted Ordering Information table.Go
  • Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go