4 Revision History
Changes from Revision C (June 2021) to Revision D (June 2021)
- Added Applications: Industrial PCs, Wired networking, and
Data center and enterprise computingGo
- Changed the table note in the ESD Ratings - IEC Specifications to make it
applicable to D, DB and PW packages. Go
- Changed the thermal paramater values for D, DB and PW packages in the Thermal Information tableGo
Changes from Revision B (October 2017) to Revision C (June 2021)
- Added RGT package to the Device Information
Go
- Added the RGT Pin Configuration
Go
- Added the ESD Ratings - IEC Specifications
Go
- Added RGT to the Thermal Information
Go
- Added RGT package to the Switching
Characteristics
Go
- Changed the capacitor value From: 1 µf To: 0.1 µf in the Layout
Diagram
Go
Changes from Revision A (July 2015) to Revision B (October 2017)
- Added Feature: Interoperable with RS-232 down to 2.7-V VCC
Go
- Added Figure 6-3
Go
Changes from Revision * (April 2007) to Revision A (July 2015)
- Deleted Ordering Information table.Go
- Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go