SLLS822C July   2007  – December 2024 TRSF3221E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings, IEC Specifications
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Resistance Characteristics
    6. 5.6  Electrical Characteristics
    7. 5.7  Electrical Characteristics, Driver
    8. 5.8  Switching Characteristics, Driver
    9. 5.9  Electrical Characteristics, Receiver
    10. 5.10 Switching Characteristics, Receiver
    11. 5.11 Electrical Characteristics, Auto-Powerdown
    12. 5.12 Switching Characteristics, Auto-Powerdown
    13. 5.13 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Typical Application
        1. 8.1.1.1 Design Requirements
        2. 8.1.1.2 Detailed Design Procedure
      2. 8.1.2 Application Performance Plot
    2. 8.2 Power Supply Recommendations
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision B (July 2021) to Revision C (December 2024)

  • Changed the Device Information table to the Package Information tableGo
  • Added the SOT-23-THN (DYY) package to the data sheetGo
  • Added Note 2 to the ESD Ratings, IEC Specifications Go

Changes from Revision A (May 2021) to Revision B (July 2021)

  • Changed the Applications listGo
  • Changed the table note for the ESD Ratings, IEC Specifications table to make it also applicable to PW package.Go
  • Changed the thermal information for PW packageGo

Changes from Revision * (August 2007) to Revision A (May 2021)

  • Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo