SLLS822B July   2007  – July 2021 TRSF3221E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings, IEC Specifications
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Resistance Characteristics
    6. 6.6  Electrical Characteristics
    7. 6.7  Electrical Characteristics, Driver
    8. 6.8  Switching Characteristics, Driver
    9. 6.9  Electrical Characteristics, Receiver
    10. 6.10 Switching Characteristics, Receiver
    11. 6.11 Electrical Characteristics, Auto-Powerdown
    12. 6.12 Switching Characteristics, Auto-Powerdown
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Typical Application
        1. 9.1.1.1 Design Requirements
        2. 9.1.1.2 Detailed Design Procedure
      2. 9.1.2 Application Performance Plot
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Resistance Characteristics

THERMAL METRIC(1)TRSF3221EUNIT
DB (SSOP)PW (TSSOP)RGT (VQFN)
16 Pins16 Pins16 Pins
R θJAJunction-to-ambient thermal resistance 82110.958.8°C/W
R θJC(top)Junction-to-case (top) thermal resistance45.741.755.8°C/W
R θJBJunction-to-board thermal resistance 44.457.223.8°C/W
ψ JTJunction-to-top characterization parameter 11.04.21.7°C/W
ψ JBJunction-to-board characterization parameter 43.856.623.7°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistance N/AN/A9°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.