SCDS263E September   2009  – July 2024 TS3USB221E

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Dynamic Electrical Characteristics, VCC = 3.3 V ±10%
    7. 5.7  Dynamic Electrical Characteristics, VCC = 2.5 V ±10%
    8. 5.8  Switching Characteristics, VCC = 3.3 V ±10%
    9. 5.9  Switching Characteristics, VCC = 2.5 V ±10%
    10. 5.10 Typical Characteristics
  7.   Parameter Measurement Information
  8. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Low Power Mode
    4. 6.4 Device Functional Modes
  9. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  11. Revision History
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)(1)
PARAMETERTEST CONDITIONSMINTYP(2)MAXUNIT
VIKVCC = 3.6 V, 2.7 V,II = –18 mA–1.8V
IINControl
inputs
VCC = 3.6 V, 2.7 V, 0 V,VIN = 0 V to 3.6 V±1μA
IOZ(3)VCC = 3.6 V, 2.7 V,
VO = 0 V to 5.25 V, VI = 0 V,
VIN = VCC or GND,
Switch OFF
±1μA
IOFFVCC = 0 VVI/O = 0 V to 5.25 V±2μA
VI/O = 0 V to 3.6 V±2
VI/O = 0 V to 2.7 V±1
ICCVCC = 3.6 V, 2.7 V,
VIN = VCC or GND,
II/O = 0 V,
Switch ON or OFF
30μA
ICC (low power mode)VCC = 3.6 V, 2.7 V,
VIN = VCC or GND
Switch disabled
( OE in high state)
1μA
ICC(4)Control
inputs
One input at 1.8 V,
Other inputs at VCC or GND
VCC = 3.6 V20μA
VCC = 2.7 V0.5
CinControl
inputs
VCC = 3.3 V, 2.5 V,VIN = 3.3 V or 0 V1.52.5pF
Cio(OFF)VCC = 3.3 V, 2.5 V,VI/O = 3.3 V or 0 V,Switch OFF3.55pF
Cio(ON)VCC = 3.3 V, 2.5 V,VI/O = 3.3 V or 0 V,Switch ON67.5pF
rON(5)VCC = 3 V, 2.3 VVI = 0 V,IO = 30 mA36
VI = 2.4 V,IO = –15 mA3.46
ΔrONVCC = 3 V, 2.3 VVI = 0 V,IO = 30 mA0.2
VI = 1.7,IO = –15 mA0.2
rON(flat)VCC = 3 V, 2.3 VVI = 0 V,IO = 30 mA1
VI = 1.7,IO = –15 mA1
VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals.