SCDS371E January   2018  – April 2019 TS5MP646

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified D-PHY Schematic
      2.      Simplified C-PHY Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Powered-Off Protection
      2. 8.3.2 1.8-V Logic Compatible Inputs
      3. 8.3.3 Low Power Disable Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pin Functions
      2. 8.4.2 Low Power Disable Mode
      3. 8.4.3 Switch Enabled Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 MIPI D-PHY Application
        2. 9.2.3.2 MIPI C-PHY Application
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TS5MP646 is a four data lane MIPI switch. This device is an optimized 10-channel (5 differential) single-pole, double-throw switch for use in high speed applications. The TS5MP646 is designed to facilitate multiple MIPI compliant devices to connect to a single CSI/DSI, C-PHY/D-PHY module.

The device has a bandwidth of 3 GHz, low channel-to-channel skew with little signal degradation, and wide margins to compensate for layout losses. The device's low current consumption meets the needs of low power applications, including mobile phones and other personal electronics.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TS5MP646 DSBGA (YFP) 2.42 mm x 2.42 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.