SCDS371E January   2018  – April 2019 TS5MP646

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified D-PHY Schematic
      2.      Simplified C-PHY Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Powered-Off Protection
      2. 8.3.2 1.8-V Logic Compatible Inputs
      3. 8.3.3 Low Power Disable Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pin Functions
      2. 8.4.2 Low Power Disable Mode
      3. 8.4.3 Switch Enabled Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 MIPI D-PHY Application
        2. 9.2.3.2 MIPI C-PHY Application
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from D Revision (January 2019) to E Revision

  • Added min differential bandwidth specification 2.7 GHzGo
  • Changed typ differential bandwith specification to 4.1 GHzGo

Changes from C Revision (August 2018) to D Revision

  • Added the Simplified D-PHY and C-PHY SchematicGo
  • Added the Typical D-PHY and C-PHY Application circuitsGo
  • Added Eye diagrams to the Application Curves sectionGo
  • Added the MIPI D-PHY Application sectionGo
  • Added the MIPI C-PHY Application sectionGo

Changes from B Revision (July 2018) to C Revision

  • Changed the Applications listGo

Changes from A Revision (March 2018) to B Revision

    Changes from * Revision (January 2018) to A Revision

    • Changed the BODY SIZE (NOM) in the Device Information table From: 2.459 x 2.459 To: 2.42 x 2.42Go