SLOSEC9 September   2024 TSD5402-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements for I2C Interface Signals
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input and Preamplifier
      2. 6.3.2 Pulse-Width Modulator (PWM)
      3. 6.3.3 Gate Drive
      4. 6.3.4 Power FETs
      5. 6.3.5 Load Diagnostics
        1. 6.3.5.1 Load Diagnostics Sequence
        2. 6.3.5.2 Faults During Load Diagnostics
      6. 6.3.6 Protection and Monitoring
      7. 6.3.7 I2C Serial Communication Bus
        1. 6.3.7.1 I2C Bus Protocol
        2. 6.3.7.2 Random Write
        3. 6.3.7.3 Random Read
        4. 6.3.7.4 Sequential Read
    4. 6.4 Device Functional Modes
      1. 6.4.1 Hardware Control Pins
      2. 6.4.2 EMI Considerations
      3. 6.4.3 Operating Modes and Faults
  8. 7 Register Maps
    1. 7.1 I2C Address Register Definitions
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Amplifier Output Filtering
        2. 8.2.1.2 Amplifier Output Snubbers
        3. 8.2.1.3 Bootstrap Capacitors
        4. 8.2.1.4 Analog Signal Input Filter
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Unused Pin Connections
          1. 8.2.2.1.1 HI-Z Pin
          2. 8.2.2.1.2 STANDBY Pin
          3. 8.2.2.1.3 I2C Pins (SDA and SCL)
          4. 8.2.2.1.4 Terminating Unused Outputs
          5. 8.2.2.1.5 Using a Single-Ended Signal Input
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
        1. 8.4.2.1 Top Layer
        2. 8.4.2.2 Second Layer – Signal Layer
        3. 8.4.2.3 Third Layer – Power Layer
        4. 8.4.2.4 Bottom Layer – Ground Layer
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
      1. 11.1.1 Packaging Information
      2. 11.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.1 Design Requirements

Use the following for the design requirements:

Power supplies

  • The device requires only a single power supply compliant with the recommended operation range. The device is designed to work with either a vehicle battery or regulated power supply such as from a backup battery.

Communication

  • The device communicates with the system controller with both discrete hardware control pins and with I2C. The device is an I2C target and thus requires a controller. If a controller I2C-compliant device is not present in the system, the device can still be used, but only with the default settings. Diagnostic information is limited to the discrete reporting FAULT pin.

External components

  • Table 8-1 lists the components required for the device.

Table 8-1 Supporting Components
EVM DESIGNATORQUANITYVALUESIZEDESCRIPTIONUSE IN APPLICATION
C7110 μF ± 10%1206X7R ceramic capacitor, 25-VPower supply
C81330 μF ± 20%10 mmLow-ESR aluminum capacitor, 25-VPower supply
C9, C16, C2031 μF ± 10%0805X7R ceramic capacitor, 25-VAnalog signal input filter, bypass
C10, C1420.22 μF ± 10%0603X7R ceramic capacitor, 25-VBootstrap capacitors
C11, C1723.3 μF ± 10%0805X7R ceramic capacitor, 25-VAmplifier output filtering
C13, C152470 pF ± 10%0603X7R ceramic capacitor, 250-VAmplifier output snubbers
C610.1 μF ± 10%0603X7R ceramic capacitor, 25-VPower supply
C212200 pF ± 10%0603X7R ceramic capacitor, 50-VPower supply
C310.082 μF ± 10%0603X7R ceramic capacitor, 25-VPower supply
C4, C524.7 μF ± 10%1206X7R ceramic capacitor, 25-VPower supply
C12, C1820.01 μF ± 10%0603X7R ceramic capacitor, 25-VOutput EMI filtering
L1110 μH ± 20%13.5 mm ×13.5 mmShielded ferrite inductorPower supply
L21

47

μH ± 20%		8 mm × 8 mmCoupled inductorAmplifier output filtering
R5, R6249.9 kΩ ± 1%0805Resistors, 0.125-WAnalog signal input filter
R4, R725.6 Ω ± 5%0805Resistors, 0.125-WOutput snubbers