SLOSEC9 September 2024 TSD5402-Q1
PRODUCTION DATA
THERMAL METRIC(1) | TSD5402 | UNIT | |
---|---|---|---|
PWP (HTSSOP) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 39.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 24.9 | °C/W |
RθJB | Junction-to-board thermal resistance | 20 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.6 | °C/W |
ψJB | Junction-to-board characterization parameter | 19.8 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2 | °C/W |