SLLSFP2
September 2024
TUSB1021-Q1
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Timing Requirements
5.7
Switching Characteristics
5.8
Typical Characteristics
6
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
USB 3.2
7.3.2
4-Level Inputs
7.3.3
Receiver Linear Equalization
7.4
Device Functional Modes
7.4.1
USB 3.2 2:1 MUX Description
7.4.2
Linear EQ Configuration
7.4.3
USB3.2 Modes
7.4.4
Operation Timing – Power Up
7.5
Programming
7.5.1
TUSB1021-Q1 I2C Target Behavior
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
ESD Protection
8.2.3
Application Curve
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Register Maps
9.1
General Register (address = 0x0A) [reset = 00000001]
9.2
USB3.2 Control/Status Registers (address = 0x20) [reset = 00000000]
9.3
USB3.2 Control/Status Registers (address = 0x21) [reset = 00000000]
9.4
USB3.2 Control/Status Registers (address = 0x22) [reset = 00000000]
10
Device and Documentation Support
10.1
Receiving Notification of Documentation Updates
10.2
Support Resources
10.3
Trademarks
10.4
Electrostatic Discharge Caution
10.5
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RGF|40
MPQF173F
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sllsfp2_oa
sllsfp2_pm
5.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per AEC Q100-002
(1)
, all pins
±4000
V
Charged device model (CDM), per AEC Q100-011, all pins
±1500
(1)
AEC Q100-002 indicates that HBM stressing must be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.