SLLSF15D August   2017  – May 2019 TUSB1042I

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematics
      2.      TUSB1042I Eye Diagram
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Supply Characteristics
    6. 6.6  DC Electrical Characteristics
    7. 6.7  AC Electrical Characteristics
    8. 6.8  DCI Specific Electrical Characteristics
    9. 6.9  Timing Requirements
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 USB 3.1
      2. 8.3.2 4-level Inputs
      3. 8.3.3 Receiver Linear Equalization
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Configuration in GPIO Mode
      2. 8.4.2 Device Configuration In I2C Mode
      3. 8.4.3 Linear EQ Configuration
      4. 8.4.4 USB3.1 Modes
      5. 8.4.5 Operation Timing – Power Up
    5. 8.5 Programming
    6. 8.6 Register Maps
      1. 8.6.1 General Register (address = 0x0A) [reset = 00000001]
        1. Table 9. General Registers
      2. 8.6.2 USB3.1 Control/Status Registers (address = 0x20) [reset = 00000000]
        1. Table 10. USB3.1 Control/Status Registers (0x20)
      3. 8.6.3 USB3.1 Control/Status Registers (address = 0x21) [reset = 00000000]
        1. Table 11. USB3.1 Control/Status Registers (0x21)
      4. 8.6.4 USB3.1 Control/Status Registers (address = 0x22) [reset = 00000100]
        1. Table 12. USB3.1 Control/Status Registers (0x22)
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 System Examples
      1. 9.3.1 USB 3.1
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I2C (Refer to Figure 9)
fSCL I2C clock frequency 1 MHz
tBUF Bus free time between START and STOP conditions 0.5 µs
tHDSTA Hold time after repeated START condition. After this period, the first clock pulse is generated 0.26 µs
tLOW Low period of the I2C clock 0.5 µs
tHIGH High period of the I2C clock 0.26 µs
tSUSTA Setup time for a repeated START condition 0.26 µs
tHDDAT Data hold time 0 μs
tSUDAT Data setup time 50 ns
tR Rise time of both SDA and SCL signals 120 ns
tF Fall time of both SDA and SCL signals 20 × (V(I2C)/5.5 V) 120 ns
tSUSTO Setup time for STOP condition 0.26 μs
Cb Capacitive load for each bus line 150 pF