SNLS757B June   2024  – November 2024 TUSB2E221

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Variants
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  8. 7 Parametric Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 USB 2.0
      2. 8.3.2 eUSB2
      3. 8.3.3 Cross MUX
    4. 8.4 Device Functional Modes
      1. 8.4.1  Repeater Mode
      2. 8.4.2  Power-Down Mode
      3. 8.4.3  UART Mode
      4. 8.4.4  Auto-Resume ECR
      5. 8.4.5  L2 State Interrupt Modes
      6. 8.4.6  Attach Detect Interrupt Mode
      7. 8.4.7  GPIO Mode
        1. 8.4.7.1 EQ0 as GPIO0
        2. 8.4.7.2 EQ1 as GPIO1
        3. 8.4.7.3 EQ2/INT as GPIO2
      8. 8.4.8  CROSS
      9. 8.4.9  USB 2.0 High-Speed HOST Disconnect Detection
      10. 8.4.10 Frame Based Low Power Mode
    5. 8.5 Programming
      1. 8.5.1 I2C Target Interface
      2. 8.5.2 Register Access Protocol (RAP)
  10. 9 Register Map
    1. 9.1 TUSB2E221 Registers
  11. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application: Dual Port System
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 eUSB PHY Settings Recommendation
      3. 10.2.3 Application Curve
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Power-Up Reset
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Example Layout
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TUSB2E221 TUSB2E221 UNIT
VBW (WQFN) YCG (DSBGA)
20 PINS 25 PINS
RθJA Junction-to-ambient thermal resistance 71.9 73.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 25.9 0.4 °C/W
RθJB Junction-to-board thermal resistance 31.7 18.9 °C/W
ΨJT Junction-to-top characterization parameter 0.5 0.2 °C/W
ΨJB Junction-to-board characterization parameter 30.9 18.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.