SLLSEV4 February   2017 TUSB319-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Cables, Adapters, and Direct Connect Devices
        1. 7.1.1.1 USB Type-C Receptacles and Plugs
        2. 7.1.1.2 USB Type-C Cables
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Downstream Facing Port (DFP) - Source
      2. 7.3.2 Type-C Current Mode
      3. 7.3.3 VBUS Detection
      4. 7.3.4 Cable Orientation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Unattached Mode
      2. 7.4.2 Active Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 DFP Mode
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Initialization Set Up
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage VDD –0.3 6 V
Control pins CC1, CC2, CURRENT_MODE, ID, DIR –0.3 6 V
VBUS_DET –0.3 4
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±3000 V
Charged-device model (CDM), per AEC Q100-0111 ±1500
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VDD Supply voltage range 3.8 5.5 V
VDD(transient) Transient voltage (with maximum width of 5 ms) 3.5 6 V
VDD(ramp) VDD ramp time 40 mS
VBUS System VBUS voltage 0 5 28 V
VBUS_DET VBUS_DET threshold voltage on the pin 3.8 V
TA Operating free air temperature range –40 25 85 °C
TJ Junction temperature –40 105 °C

6.4 Thermal Information

THERMAL METRIC(1) TUSB319-Q1 UNIT
DRF (WSON)
8 PINS
RθJA Junction-to-ambient thermal resistance 92.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 66.6 °C/W
RθJB Junction-to-board thermal resistance 40.8 °C/W
ψJT Junction-to-top characterization parameter 3.4 °C/W
ψJB Junction-to-board characterization parameter 46.3 °C/W
RθJC(bot) Junction-to-case (bot) thermal resistance 43.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and C Package Thermal Metrics application report.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Device average power consumption Active 105 140 µA
Unattached 105 140 µA
CC1 and CC2 Pins
ICC(DEFAULT_P) Default mode pullup current source. 64 80 96 µA
ICC(MED_P) Medium (1.5 A) mode pullup current source. 166 180 194 µA
ICC(HIGH_P) High (3 A) mode pullup current source. 304 330 356 µA
I(FS,CC) Fail safe current (CC1, CC2) VDD = 0 V,
CC1, CC2 = 5 V 		1 µA
Control Pins: CURRENT_MODE, DIR, ID
VIL Low-level control signal input voltage, (CURRENT_MODE) 0.4 V
VIM Mid-level control signal input voltage (CURRENT_MODE) 0.28 × VDD 0.56 × VDD V
VIH High-level control signal input voltage (CURRENT_MODE) VDD - 0.3 V
IIH High-level input current –1 1 µA
IIL Low-level input current –1 1 µA
I(FS,ID) Fail safe current (ID) VDD = 0 V,
ID = 5 V 		1 µA
RPD(CUR) Internal pulldown resistance for CURRENT_MODE pin 275 kΩ
VOL Low-level signal output voltage (open-drain) (ID and DIR) IOL = –1.6 mA 0.4 V
Rp(ODext) External pullup resistor on open drain IOs (ID and DIR) 200 kΩ
Rp(cm_med) External pull-up resistor on CURRENT_MODE pin to advertise 1.5-A current 500 kΩ
Rp(cm_high) External pull-up resistor on CURRENT_MODE pin to advertise 3-A current 10 kΩ
VBUS_DET IO Pins (Connected to System VBUS signal through external resistor)
VBUS(THR) VBUS threshold range 2.4 3.3 4.2 V
VBUS_DET(THR) VBUS_DET pin threshold 236 315 394 mV
RVBUS External resistor between VBUS and VBUS_DET pin 850 900(1) 910 KΩ
RVBUS(PD) Internal pulldown resistance for VBUS_DET 95 KΩ
(1) If smaller RVBUS is desired add an additional resistor from VBUS_DET pin to GND in parallel to internal 95K resistor keeping the same ratio of pull-up and pull-down resistors.

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
tCCCB_DEFAULT Port attachment debounce time 168 ms
tVBUS_DB Debounce of VBUS_DET pin after valid VBUS_THR (See Figure 1.) 2 ms
TUSB319-Q1 tvbus_db_sllseo6.gif Figure 1. VBUS Detect and Debounce