SLLSEN9F May   2015  – March 2022 TUSB320

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 Cables, Adapters, and Direct Connect Devices
        1. 7.2.1.1 USB Type-C Receptacles and Plugs
        2. 7.2.1.2 USB Type-C Cables
        3. 7.2.1.3 Legacy Cables and Adapters
        4. 7.2.1.4 Direct Connect Devices
        5. 7.2.1.5 Audio Adapters
    3. 7.3 Feature Description
      1. 7.3.1 Port Role Configuration
        1. 7.3.1.1 Downstream Facing Port (DFP) – Source
        2. 7.3.1.2 Upstream Facing Port (UFP) – Sink
        3. 7.3.1.3 Dual Role Port (DRP)
      2. 7.3.2 Type-C Current Mode
      3. 7.3.3 Accessory Support
        1. 7.3.3.1 Audio Accessory
        2. 7.3.3.2 Debug Accessory
      4. 7.3.4 I2C and GPIO Control
      5. 7.3.5 VBUS Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Unattached Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 Dead Battery Mode
      4. 7.4.4 Shutdown Mode
    5. 7.5 Programming
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 DRP in I2C Mode
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DFP in I2C Mode
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 UFP in I2C Mode
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
    3. 8.3 Initialization Set Up
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision E (May 2017) to Revision F (March 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated the term master to controller throughout the data sheet to align with MIPI I3C specification and NXP's Inclusive Language ProjectGo
  • Added the Junction Temperature to the Absolute Maximum Ratings sectionGo
  • Changed the tCCCB_DEFAULT typical parameter from 168 ms to 133 msGo
  • Added Functional Block Diagram sectionGo

Changes from Revision D (October 2016) to Revision E (May 2017)

  • Changed RVBUS values From: MIN = 891, TYP = 900, MAX = 909 KΩ To: MIN = 855, TYP = 887, MAX = 920 KΩ Go

Changes from Revision C (September 2016) to Revision D (October 2016)

  • Changed text for Pin 7 in the Pin Functions table From: "default current mode detected (H); medium or high current mode detected (L)." To: "Refer to Table 7-3 for more details."Go
  • Changed text for Pin 8 in the Pin Functions table From: "default or medium current mode detected (H); high current mode detected (L)." To: "Refer to Table 7-3 for more details."Go

Changes from Revision B (March 2016) to Revision C (September 2016)

  • Changed pins CC1 and CC2 values From: MIN = -0.3 MAX = VDD + 0.3 To: MIN -0.3 MAX = 6 in the Section 6.1 Go

Changes from Revision A (June 2015) to Revision B (March 2016)

  • Added Note 1 and 2 to the Pin Functions tableGo
  • Changed the DESCRIPTION of pin EN_N pin in the Pin Functions tableGo
  • Changed the DESCRIPTION of pin VDD in the Pin Functions tableGo
  • Changed the MIN, TYP, and MAX values for VTH_UFP_CC_USB, VTH_UFP_CC_MED, and VTH_UFP_CC_HIGH in the Section 6.5 table.Go
  • Added Test Condition "See Figure 6-1" to VBUS_THR in the Section 6.5 Go
  • Added Note 2 to the Section 6.5 table Go
  • Updated Section 6.6 table with new values.Go
  • Added Data hold time, Data valid time, Data valid acknowledge time, and Cbus_400kHz values to Section 6.6 table.Go
  • Changed the Section 6.7 table Go
  • Added Note: "SW must make sure..." to the Description of INTERRUPT_STATUS in Table 7-7 Go
  • Added text to list item 2 in the Section 8.3 sectionGo

Changes from Revision * (May 2015) to Revision A (June 2015)

  • Changed device status of TUSB320 from Product Preview to Production Data Go