SLLSER3F December   2015  – December 2023 TUSB542

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics, Power Supply Currents
    6. 5.6  Electrical Characteristics, DC
    7. 5.7  Electrical Characteristics, Dynamic
    8. 5.8  Electrical Characteristics, AC
    9. 5.9  Timing Requirements
    10. 5.10 Switching Characteristics
    11. 5.11 Typical Characteristics
      1. 5.11.1 1-Inch Pre Channel
      2. 5.11.2 24-Inch Pre Channel
      3. 5.11.3 32-Inch Pre Channel
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Receiver Equalization
      2. 6.3.2 De-Emphasis Control and Output Swing
      3. 6.3.3 Automatic LFPS Detection
      4. 6.3.4 Automatic Power Management
    4. 6.4 Device Functional Modes
      1. 6.4.1 Disconnect Mode
      2. 6.4.2 U Modes
        1. 6.4.2.1 U0 Mode
        2. 6.4.2.2 U2/U3 Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications, USB Type-C Port SS MUX
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Typical Application: Switching USB SS Host or Device Ports
      1. 7.3.1 Design Requirements
      2. 7.3.2 Detailed Design Procedure
      3. 7.3.3 Application Curves
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RWQ|18
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)±2000V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.