SLLSEF7 March   2014 TUSB8020B-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Terminal Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 3.3-V I/O Electrical Characteristics
    6. 7.6 Power-Up Timing Requirements
    7. 7.7 Hub Input Supply Current
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Battery Charging Features
      2. 8.3.2 USB Power Management
      3. 8.3.3 One Time Programmable (OTP) Configuration
      4. 8.3.4 Clock Generation
        1. 8.3.4.1 Crystal Requirements
        2. 8.3.4.2 Input Clock Requirements
      5. 8.3.5 Power Up and Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 External Configuration Interface
      2. 8.4.2 I2C EEPROM Operation
      3. 8.4.3 SMBus Slave Operation
    5. 8.5 Register Maps
      1. 8.5.1 Configuration Registers
        1. 8.5.1.1  ROM Signature Register
        2. 8.5.1.2  Vendor ID LSB Register
        3. 8.5.1.3  Vendor ID MSB Register
        4. 8.5.1.4  Product ID LSB Register
        5. 8.5.1.5  Product ID MSB Register
        6. 8.5.1.6  Device Configuration Register
        7. 8.5.1.7  Battery Charging Support Register
        8. 8.5.1.8  Device Removable Configuration Register
        9. 8.5.1.9  Port Used Configuration Register
        10. 8.5.1.10 PHY Custom Configuration Register
        11. 8.5.1.11 Device Configuration Register 2
        12. 8.5.1.12 UUID Registers
        13. 8.5.1.13 Language ID LSB Register
        14. 8.5.1.14 Language ID MSB Register
        15. 8.5.1.15 Serial Number String Length Register
        16. 8.5.1.16 Manufacturer String Length Register
        17. 8.5.1.17 Product String Length Register
        18. 8.5.1.18 Serial Number Registers
        19. 8.5.1.19 Manufacturer String Registers
        20. 8.5.1.20 Product String Registers
        21. 8.5.1.21 Additional Feature Configuration Register
        22. 8.5.1.22 Charging Port Control Register
        23. 8.5.1.23 Device Status and Command Register
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Upstream Port Implementation
        2. 9.2.2.2 Downstream Port 1 Implementation
        3. 9.2.2.3 Downstream Port 2 Implementation
        4. 9.2.2.4 VBUS Power Switch Implementation
        5. 9.2.2.5 Clock, Reset, and Misc
        6. 9.2.2.6 Power Implementation
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply
    2. 10.2 Downstream Port Power
    3. 10.3 Ground
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Placement
      2. 11.1.2 Package Specific
      3. 11.1.3 Differential Pairs
    2. 11.2 Layout Example
      1. 11.2.1 Upstream Port
      2. 11.2.2 Downstream Port
      3. 11.2.3 Thermal Pad
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
VDD Steady-state supply voltage –0.3 to 1.4 V
VDD33 Steady-state supply voltage –0.3 to 3.8 V

7.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
VESD Human-Body Model (HBM) AEC-Q100 Classification Level H2 2000 V
Charged-Device Model (CDM) AEQ-Q100 Classification Level C4B for corner pins 750
Charged-Device Model (CDM) AEQ-Q100 Classification Level C4B for non-corner pins 500

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VDD(1) 1.1 supply voltage 0.99 1.1 1.26 V
VDD33 3.3 supply voltage 3 3.3 3.6 V
USB_VBUS Voltage at USB_VBUS PAD 0 1.155 V
TA Operating free-air temperature range -40 25 85 °C
TJ Operating junction temperature range -40 25 105 °C
(1) A 1.05-V, 1.1-V, or 1.2-V supply may be used as long as minimum and maximum supply conditions are met.

7.4 Thermal Information

THERMAL METRIC(1) TUSB8020B-Q1 UNIT
PHP
48 PIN
RθJA Junction-to-ambient thermal resistance(2) 31.8 °C/W
RθJCtop Junction-to-case (top) thermal resistance(3) 16.1
RθJB Junction-to-board thermal resistance(4) 13
ψJT Junction-to-top characterization parameter(5) 0.5
ψJB Junction-to-board characterization parameter(6) 12.9
RθJCbot Junction-to-case (bottom) thermal resistance(7) 0.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

7.5 3.3-V I/O Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER OPERATION TEST CONDITIONS MIN MAX UNIT
VIH High-level input voltage(1) VDD33 2 VDD33 V
VIL Low-level input voltage(1) VDD33 0 0.8 V
VI Input voltage 0 VDD33 V
VO Output voltage(2) 0 VDD33 V
tt Input transition time (trise and tfall) 0 25 ns
Vhys Input hysteresis(3) 0.13 x VDD33 V
VOH High-level output voltage VDD33 IOH = -4 mA 2.4 V
VOL Low-level output voltage VDD33 IOL = 4 mA 0.4 V
IOZ High-impedance, output current(2) VDD33 VI = 0 to VDD33 ±20 µA
IOZP High-impedance, output current with internal pullup or pulldown resistor(4) VDD33 VI = 0 to VDD33 ±225 µA
II Input current(5) VDD33 VI = 0 to VDD33 ±15 µA
(1) Applies to external inputs and bidirectional buffers.
(2) Applies to external outputs and bidirectional buffers.
(3) Applies to GRSTz.
(4) Applies to pins with internal pullups/pulldowns.
(5) Applies to external input buffers.

7.6 Power-Up Timing Requirements

MIN TYP MAX UNIT
Td1 VDD33 stable before VDD stable. There is no timing relationship between VDD33 and VDD 0 ms
Td2 VDD and VDD33 stable before de-assertion of GRSTZ. 3 ms
Tsu_io Setup for MISC inputs sampled at the de-assertion of GRSTZ(1) 0.1 µs
Thd_io Hold for MISC inputs sampled at the de-assertion of GRSTZ.(1) 0.1 µs
TVDD33_RAMP VDD33 supply ramp requirements 0.2 100 ms
TVDD_RAMP VDD supply ramp requirements 0.2 100 ms
(1) Misc pins sampled at de-assertion of GRSTZ: FULLPWRMGMTz, GANGED, PWRCTL_POL, SMBUSz, BATEN1, and BATEN2
Pwr_up_timing_sllsef7.gifFigure 1. Power-Up Timing Requirements

7.7 Hub Input Supply Current

Typical values measured at TA = 25°C
PARAMETER VDD33 VDD11 UNIT
3.3 V 1.1 V
LOW POWER MODES
Power On (after Reset)                    5 39 mA
Disconnect from Host 5 39 mA
Suspend (USB2 Host)                                   5 39 mA
Suspend (USB3 Host) 6 40 mA
ACTIVE MODES (US state / DS State)
3.0 host / 1 SS Device and Hub in U1 50 218 mA
3.0 host / 1 SS Device and Hub in U0 50 342 mA
3.0 host / 2 SS Devices and Hub in U1 50 284 mA
3.0 host / 2 SS Devices and Hub in U0 50 456 mA
3.0 host / 1 SS and 1 HS Device in U1 92 242 mA
3.0 host / 1 SS and 1 HS Device in U0 93 364 mA
2.0 host / 1 HS Device active 48 71 mA
2.0 host / 2 HS Devices active 60 80 mA