SLVSEQ1A September   2018  – December 2018 TVS0701

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Voltage Clamp Response to 8/20 µs Surge Event
      2.      Functional Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings - JEDEC
    3. 7.3 ESD Ratings - IEC
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Electrical Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Protection Specifications
      2. 8.4.2 Reliability Testing
      3. 8.4.3 Zero Derating
      4. 8.4.4 Bidirectional Operation
      5. 8.4.5 Transient Performance
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
    3. 9.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.6 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ILEAK Leakage Current Measured at VIN = ±VRWM, TA = 27°C 0.25 40 nA
Measured at VIN = ±VRWM, TA = 85°C 200
VBR Break-down Voltage IIN = ±1mA 9.3 10 V
VCLAMP Clamp Voltage ±Ipp IEC 61000-4-5 Surge (8/20 µs), VIN = 0 V before surge, TA = 27°C 11 11.7 V
±IPP IEC 61000-4-5 Surge (8/20 µs), VIN =±VRWM before surge, TA = 125°C 12.9
RDYN 8/20 µs surge dynamic resistance Calculated from VCLAMP at .5*IPP and IPP surge current, TA = 25°C 120 mΩ
CIN Input pin capacitance VIN = VRWM, f = 1 MHz, 30 mVpp, IO to GND 77 pF
SR Maximum Slew Rate 0-±VRWM rising edge, sweep rise time and measure slew rate when IPEAK = 1 mA, TA = 27°C 2.5 V/µs
0-±VRWM rising edge, sweep rise time and measure slew rate when IPEAK = 1 mA, TA = 85°C 1.0