SCES643I November   2006  – December 2024 TXB0108

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Handling Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: VCCA = 1.2 V
    7. 5.7  Timing Requirements: VCCA = 1.5 V ± 0.1 V
    8. 5.8  Timing Requirements: VCCA = 1.8 V ± 0.15 V
    9. 5.9  Timing Requirements: VCCA = 2.5 V ± 0.2 V
    10. 5.10 Timing Requirements: VCCA = 3.3 V ± 0.3 V
    11. 5.11 Switching Characteristics: VCCA = 1.2 V
    12. 5.12 Switching Characteristics: VCCA = 1.5 V ± 0.1 V
    13. 5.13 Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    14. 5.14 Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    15. 5.15 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    16. 5.16 Operating Characteristics
    17. 5.17 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Addendum
      1. 13.1.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZXY|20
  • NME|20
  • YZP|20
  • DQS|20
  • PW|20
  • RGY|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

TXB0108
A. For the RGY/RUK package, the exposed center thermal pad must be connected to ground.
B. Pullup resistors are not required on both sides for Logic I/O.
C. If pullup or pulldown resistors are needed, the resistor value must be over 50kΩ.
D. 50 kΩ is a safe recommended value, if the customer can accept higher VOL or lower VOH, smaller pullup or pulldown resistor is allowed, the draft estimation is VOL = VCCOUT × 4.5 k/(4.5 k + RPU) and VOH = VCCOUT × RDW/(4.5 k + RDW).
E. If pullup resistors are needed, please refer to the TXS0108 or contact TI.
F. For detailed information, please refer A Guide to Voltage Translation With TXB-Type Translators.
TXB0108
TXB0108 NME/GXY/ZXY PACKAGE(BOTTOM VIEW)Figure 4-1 NME/GXY/ZXY PACKAGE(BOTTOM VIEW)
Table 4-1 Pin Functions
PIN I/O(1) FUNCTION
SIGNAL NAME PW, RGY NO. DQS NO. YZP GRID LOCATOR
A1 1 1 A3 I/O Input/output 1. Referenced to VCCA.
VCCA 2 5 C4 S A-port supply voltage. 1.1 V ≤ VCCA ≤ 3.6 V, VCCA ≤ VCCB.
A2 3 2 A4 I/O Input/output 2. Referenced to VCCA.
A3 4 3 B3 I/O Input/output 3. Referenced to VCCA.
A4 5 4 B4 I/O Input/output 4. Referenced to VCCA.
A5 6 7 C3 I/O Input/output 5. Referenced to VCCA.
A6 7 8 E4 I/O Input/output 6. Referenced to VCCA.
A7 8 9 D3 I/O Input/output 7. Referenced to VCCA.
A8 9 10 E3 I/O Input/output 8. Referenced to VCCA.
OE 10 6 D4 I Output enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA.
GND 11 15 D1 S Ground
B8 12 11 E2 I/O Input/output 8. Referenced to VCCB.
B7 13 12 D2 I/O Input/output 7. Referenced to VCCB.
B6 14 13 E1 I/O Input/output 6. Referenced to VCCB.
B5 15 14 C2 I/O Input/output 5. Referenced to VCCB.
B4 16 17 B1 I/O Input/output 4. Referenced to VCCB.
B3 17 18 B2 I/O Input/output 3. Referenced to VCCB.
B2 18 19 A1 I/O Input/output 2. Referenced to VCCB.
VCCB 19 16 C1 S B-port supply voltage. 1.65 V ≤ VCCB  ≤ 5.5 V.
B1 20 20 A2 I/O Input/output 1. Referenced to VCCB.
Thermal Pad — — For the RGY/RUK package, the exposed center thermal pad must be connected to ground.
(1) I = input, O = output, I/O = input and output, S = power supply
Table 4-2 Pin Assignments (20-Ball NME/GXY/ZXY Package)
1 2 3 4 5
D VCCB B2 B4 B6 B8
C B1 B3 B5 B7 GND
B A1 A3 A5 A7 OE
A VCCA A2 A4 A6 A8