SCES643I November   2006  – December 2024 TXB0108

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Handling Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: VCCA = 1.2 V
    7. 5.7  Timing Requirements: VCCA = 1.5 V ± 0.1 V
    8. 5.8  Timing Requirements: VCCA = 1.8 V ± 0.15 V
    9. 5.9  Timing Requirements: VCCA = 2.5 V ± 0.2 V
    10. 5.10 Timing Requirements: VCCA = 3.3 V ± 0.3 V
    11. 5.11 Switching Characteristics: VCCA = 1.2 V
    12. 5.12 Switching Characteristics: VCCA = 1.5 V ± 0.1 V
    13. 5.13 Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    14. 5.14 Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    15. 5.15 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    16. 5.16 Operating Characteristics
    17. 5.17 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Addendum
      1. 13.1.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZXY|20
  • NME|20
  • YZP|20
  • DQS|20
  • PW|20
  • RGY|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13.1.1 Tape and Reel Information

TXB0108
*All dimensions are nominal
DevicePackage
Type		Package
Drawing		PinsSPQReel
Diameter (mm)		Reel
Width W1 (mm)		A0
(mm)		B0
(mm)		K0
(mm)		P1
(mm)		W
(mm)		Pin1
Quadrant
TXB0108DQSRUSONDQS203000177.812.42.214.220.814.012.0Q1
TXB0108RGYRVQFNRGY203000330.012.43.84.81.68.012.0Q1
TXB0108YZPRDSBGAYZP203000180.08.41.992.490.564.08.0Q1
TXB0108YZPR2DSBGAYZP203000180.08.41.992.490.564.08.0Q2
TXB0108ZXYRBGA
MICROSTAR
JUNIOR		ZXY202500330.012.42.84.223.31.012.0Q2
TXB0108
DevicePackage TypePackage DrawingPinsSPQLength (mm)Width (mm)Height (mm)
TXB0108DQSRUSONDQS203000202.0201.028.0
TXB0108RGYRVQFNRGY203000355.0350.050.0
TXB0108YZPRDSBGAYZP203000182.0182.020.0
TXB0108YZPR2DSBGAYZP203000182.0182.020.0
TXB0108ZXYRBGA MICROSTAR
JUNIOR		ZXY202500336.6336.628.6