SCES643I November   2006  – December 2024 TXB0108

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Handling Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: VCCA = 1.2 V
    7. 5.7  Timing Requirements: VCCA = 1.5 V ± 0.1 V
    8. 5.8  Timing Requirements: VCCA = 1.8 V ± 0.15 V
    9. 5.9  Timing Requirements: VCCA = 2.5 V ± 0.2 V
    10. 5.10 Timing Requirements: VCCA = 3.3 V ± 0.3 V
    11. 5.11 Switching Characteristics: VCCA = 1.2 V
    12. 5.12 Switching Characteristics: VCCA = 1.5 V ± 0.1 V
    13. 5.13 Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    14. 5.14 Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    15. 5.15 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    16. 5.16 Operating Characteristics
    17. 5.17 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Addendum
      1. 13.1.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZXY|20
  • NME|20
  • YZP|20
  • DQS|20
  • PW|20
  • RGY|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1 Application Information

The TXB0108 can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. It can only translate push-pull CMOS logic outputs. If for open-drain signal translation, please refer to TI TXS010X products. Any external pulldown or pullup resistors are recommended to be larger than 50kΩ.