SCES651K June   2006  – October 2023 TXS0104E

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information: ZXU, YZT, and NMN
    5. 6.5  Thermal Information: D, PW, and RGY
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements: VCCA = 1.8 V ± 0.15 V
    8. 6.8  Timing Requirements: VCCA = 2.5 V ± 0.2 V
    9. 6.9  Timing Requirements: VCCA = 3.3 V ± 0.3 V
    10. 6.10 Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    11. 6.11 Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    12. 6.12 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    13. 6.13 Typical Characteristics
  8. Parameter Measurement Information
    1. 7.1 Load Circuits
    2. 7.2 Voltage Waveforms
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Architecture
      2. 8.3.2 Input Driver Requirements
      3. 8.3.3 Power Up
      4. 8.3.4 Enable and Disable
      5. 8.3.5 Pullup and Pulldown Resistors on I/O Lines
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

GUID-F6E69182-289D-4F6E-9179-D2093788E38F-low.gifFigure 5-1 ZXU Package,12-Pin MICROSTAR JUNIOR(Top View)
GUID-F6E69182-289D-4F6E-9179-D2093788E38F-low.gifFigure 5-2 NMN Package,12-Pin nFBGA(Top View)
Table 5-1 Pin Functions: ZXU/ NMN
PIN TYPE(1) DESCRIPTION
NO. NAME
A1 A1 I/O Input/output A1. Referenced to VCCA.
A2 A2 I/O Input/output A2. Referenced to VCCA.
A3 A3 I/O Input/output A3. Referenced to VCCA.
A4 A4 I/O Input/output A4. Referenced to VCCA.
C1 B1 I/O Input/output B1. Referenced to VCCB.
C2 B2 I/O Input/output B2. Referenced to VCCB.
C3 B3 I/O Input/output B3. Referenced to VCCB.
C4 B4 I/O Input/output B4. Referenced to VCCB.
B4 GND Ground
B3 OE I 3-state output-mode enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA.
B2 VCCA A-port supply voltage. 1.65 V ≤ VCCA  ≤ 3.6 V and VCCA  ≤ VCCB.
B1 VCCB B-port supply voltage. 2.3 V ≤ VCCB  ≤ 5.5 V.
I = input, O = output
GUID-5CD925C4-CE49-4A0C-A9FA-A5041FB4858F-low.gif Figure 5-3 YZT Package,12-Pin DSBGA(Top View)
Table 5-2 Pin Functions: DSBGA
PIN TYPE(1) DESCRIPTION
NO. NAME
A3 A1 I/O Input/output A1. Referenced to VCCA.
B3 A2 I/O Input/output A2. Referenced to VCCA.
C3 A3 I/O Input/output A3. Referenced to VCCA.
D3 A4 I/O Input/output A4. Referenced to VCCA.
A1 B1 I/O Input/output B1. Referenced to VCCB.
B1 B2 I/O Input/output B2. Referenced to VCCB.
C1 B3 I/O Input/output B3. Referenced to VCCB.
D1 B4 I/O Input/output B4. Referenced to VCCB.
D2 GND Ground
C2 OE I 3-state output-mode enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA.
B2 VCCA A-port supply voltage. 1.65 V ≤ VCCA  ≤ 3.6 V and VCCA  ≤ VCCB.
A2 VCCB B-port supply voltage. 2.3 V ≤ VCCB  ≤ 5.5 V.
I = input, O = output
GUID-20230802-SS0I-V11C-QBWW-7D5Q6N8QQSVF-low.svg
NC - No internal connection
Figure 5-4 BQA Package,14-Pin WQFN(Top View)
GUID-EA529D75-519C-4638-B3AC-A76E4070A016-low.gif
NC - No internal connection
Figure 5-6 D and PW Package,14-Pin SOIC and TSSOP(Top View)
GUID-40000D03-5B2C-4053-8AC8-75A2D2E898DF-low.gif
NC - No internal connection
Figure 5-5 RGY Package,14-Pin VQFN(Top View)
Table 5-3 Pin Functions: D, PW, or RGY
PIN TYPE(1) DESCRIPTION
NAME NO.
A1 2 I/O Input/output A1. Referenced to VCCA.
A2 3 I/O Input/output A2. Referenced to VCCA.
A3 4 I/O Input/output A3. Referenced to VCCA.
A4 5 I/O Input/output A4. Referenced to VCCA.
B1 13 I/O Input/output B1. Referenced to VCCB.
B2 12 I/O Input/output B2. Referenced to VCCB.
B3 11 I/O Input/output B3. Referenced to VCCB.
B4 10 I/O Input/output B4. Referenced to VCCB.
GND 7 Ground
OE 8 I 3-state output-mode enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA.
VCCA 1 A-port supply voltage. 1.65 V ≤ VCCA  ≤ 3.6 V and VCCA  ≤ VCCB.
VCCB 14 B-port supply voltage. 2.3 V ≤ VCCB  ≤ 5.5 V.
Thermal Pad For the RGY package, the exposed center thermal pad must be connected to ground
GUID-20231002-SS0I-KHWW-QH7P-VQQRJRN0KFRR-low.svgFigure 5-7 RUT Package, 12-Pin UQFN (Transparent Top View)
Table 5-4 Pin Functions: RUT
PIN TYPE(1) DESCRIPTION
NAME NO.
A1 2 I/O Input/output A1. Referenced to VCCA.
A2 3 I/O Input/output A2. Referenced to VCCA.
A3 4 I/O Input/output A3. Referenced to VCCA.
A4 5 I/O Input/output A4. Referenced to VCCA.
B1 10 I/O Input/output B1. Referenced to VCCB.
B2 9 I/O Input/output B2. Referenced to VCCB.
B3 8 I/O Input/output B3. Referenced to VCCB.
B4 7 I/O Input/output B4. Referenced to VCCB.
GND 6 Ground
OE 12 I 3-state output-mode enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA.
VCCA 1 A-port supply voltage. 1.65 V ≤ VCCA  ≤ 3.6 V and VCCA  ≤ VCCB.
VCCB 11 A-port supply voltage. 1.65 V ≤ VCCA  ≤ 3.6 V and VCCA  ≤ VCCB.
I = input, O = output