SCES964 June   2024 TXS0104V

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information (PW, RGY, BQA, RUT, D)
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 1.8 ± 0.15V
    7. 5.7  Switching Characteristics, VCCA = 2.5 ± 0.2V
    8. 5.8  Switching Characteristics, VCCA = 3.3 ± 0.3V
    9. 5.9  Switching Characteristics: Tsk, TMAX
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuits
    2. 6.2 Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Power Up
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup and Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

TXS0104V BQA Package,14-Pin WQFN(Top View)
NC - No internal connection
Figure 4-1 BQA Package,14-Pin WQFN(Top View)
TXS0104V RGY Package,14-Pin VQFN(Top View)
NC - No internal connection
Figure 4-3 RGY Package,14-Pin VQFN(Top View)
TXS0104V D and PW Package,14-Pin SOIC and TSSOP(Top View)
NC - No internal connection
Figure 4-2 D and PW Package,14-Pin SOIC and TSSOP(Top View)
Table 4-1 Pin Functions: BQA, PW, D, or RGY
PIN TYPE(1) DESCRIPTION
NAME NO.
A1 2 I/O Input/output A1. Referenced to VCCA.
A2 3 I/O Input/output A2. Referenced to VCCA.
A3 4 I/O Input/output A3. Referenced to VCCA.
A4 5 I/O Input/output A4. Referenced to VCCA.
B1 13 I/O Input/output B1. Referenced to VCCB.
B2 12 I/O Input/output B2. Referenced to VCCB.
B3 11 I/O Input/output B3. Referenced to VCCB.
B4 10 I/O Input/output B4. Referenced to VCCB.
GND 7 — Ground
OE 8 I 3-state output-mode enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA.
VCCA 1 — A-port supply voltage. 1.65V ≤ VCCA  ≤ 3.6V and VCCA  ≤ VCCB.
VCCB 14 — B-port supply voltage. 2.3V ≤ VCCB  ≤ 5.5V.
Thermal Pad — For the RGY package, the exposed center thermal pad must be connected to ground
(1) I = input, O = output
TXS0104V RUT Package, 12-Pin UQFN (Transparent Top View)Figure 4-4 RUT Package, 12-Pin UQFN (Transparent Top View)
Table 4-2 Pin Functions: RUT
PIN TYPE(1) DESCRIPTION
NAME NO.
A1 2 I/O Input/output A1. Referenced to VCCA.
A2 3 I/O Input/output A2. Referenced to VCCA.
A3 4 I/O Input/output A3. Referenced to VCCA.
A4 5 I/O Input/output A4. Referenced to VCCA.
B1 10 I/O Input/output B1. Referenced to VCCB.
B2 9 I/O Input/output B2. Referenced to VCCB.
B3 8 I/O Input/output B3. Referenced to VCCB.
B4 7 I/O Input/output B4. Referenced to VCCB.
GND 6 — Ground
OE 12 I 3-state output-mode enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA.
VCCA 1 — A-port supply voltage. 1.65V ≤ VCCA  ≤ 3.6V and VCCA  ≤ VCCB.
VCCB 11 — B-port supply voltage. 2.3V ≤ VCCB  ≤ 5.5V.
(1) I = input, O = output