SLUSDO2C June 2020 – February 2021 UCC21540-Q1
PRODUCTION DATA
THERMAL METRIC(1) | UCC21540-Q1 | UNIT | |
---|---|---|---|
DWK (SOIC) | |||
RθJA | Junction-to-ambient thermal resistance | 69.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 33.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 29.0 | °C/W |
ψJT | Junction-to-top characterization parameter | 20.0 | °C/W |
ψJB | Junction-to-board characterization parameter | 28.3 | °C/W |