SLUSAF9C February   2011  – July 2024 UCC27200A , UCC27201A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Stages
      2. 6.3.2 UVLO (Undervoltage Lockout)
      3. 6.3.3 Level Shift
      4. 6.3.4 Boot Diode
      5. 6.3.5 Output Stages
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Threshold Type
        2. 7.2.2.2 VDD Bias Supply Voltage
        3. 7.2.2.3 Peak Source and Sink Currents
        4. 7.2.2.4 Propagation Delay
        5. 7.2.2.5 Power Dissipation
      3. 7.2.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from Revision B (August 2015) to Revision C (July 2024)

  • Changed document title to reflect key features of the device. Go
  • Updated several specifications to reflect device characteristics. Go
  • Updated Features section: 1) Changed junction temperature range specification from -40°C to 140°C to -40°C to 150°C. 2) Changed typical propagation delay from 20ns to 22ns. 3) Deleted Greater than 1MHz of Operation since the switching frequency is not a specified parameter. 4) Changed typical bootstrap diode resistance from 0.6Ω to 0.65Ω.Go
  • Updated Applications section with list of top 5 typical applications.Go
  • Deleted any reference to UCC27200A in DRC package in this data sheet since this package variant is obsolete. Go
  • Updated Pin Configuration and Functions section pin diagrams and pin description to indicate that the PowerPAD is internally connected to the VSS pin on the DRC package only. Go
  • Updated Absolute Maximum Ratings section to remove "Power dissipation at TA = 25°C" and "Lead temperature (soldering, 10s)". Power dissipation can be calculated with thermal metrics in "Thermal Information" table.Go
  • Updated Recommended Operating Conditions: Operating Junction Temperature maximum changed from 140°C to 150°C.Go
  • Updated Thermal Information section to reflect device characteristics. Go
  • Updated Supply Currents specifications in the Electrical Characteristics table: 1) IDD typical changed (From: 0.4mA. To: 0.11mA). 2) IDDO typical changed (From: 2.5mA for UCC27200 and 3.8mA for UCC27201. To: 1mA for both). 3) IDDO maximum changed (From: 4mA for UC27200 and 5.5mA for UCC27201. To: 3mA for both. 4) IHB typical changed (From: 0.4mA. To: 0.065mA). 5) IHBO typical changed (From: 2.5mA. To: 0.9mA). 6) IHBO maximum changed (From: 4mA. To: 3mA). 7) IHBS test condition changed to match VHS maximum recommended operating conditions (From: 110V. To: 105V). 8) IHBSO typical changed (From: 0.1mA. To: 0.03mA).Go
  • Updated Input specifications in the Electrical Characteristics table: 1) UCC27200 VHIT typical changed (From: 5.8V. To: 6V). 2) UCC27200 VLIT typical changed (From: 5.4V. To: 5.6V). 3) UCC27201 VHIT specifications changed (From: 1.7V typical, 2.5V maximum. To: 1.9V minimum, 2.3V typical, 2.7V maximum). 4) UCC27201 VLIT specifications changed (From: 0.8V minimum, 1.6V typical. To: 1.3V minimum, 1.6V typical, 1.9V maximum). 5) UCC27201 VIHYS typical changed (From: 100mV. To: 700mV). 6) UCC27201 RIN specifications changed from (100kΩ minimum, 200kΩ typical, 350kΩ maximum. To: 68kΩ typical). Go
  • Updated Bootstrap diode specifications in the Electrical Characteristics table: 1) RD test conditions changed (From: 100mA and 80mA. To: 120mA and 100mA). 2) RD typical changed (From: 0.6Ω. To: 0.65Ω). Go
  • Updated LO/HO Gate Driver specifications in the Electrical Characteristics table: 1) VLOL typical changed (From 0.18V. To 0.1V). 2) VLOH typical changed (From: 0.25V. To: 0.13V). Go
  • Removed specifications with test conditions "-40°C to 125°C TJ", since all parameters are specified from -40°C to 150°C TJ (unless otherwise noted). Go
  • Changed Propagation Delays typical specification (From: 20ns. To: 22ns).Go
  • Updated Output Rise and Fall Time specifications: 1) tR typical changed (From: 0.35us. To: 0.26us). 2) tF typical changed (From: 0.3us. To: 0.22us). Go
  • Updated all plots in Typical Characteristics section to reflect the device's typical specification. Go
  • Updated Input Stages section: 1) Changed UCC27201A input pulldown resistance typical to match the specification in the Electrical Characteristics table from 70kΩ to 68kΩ. 2) Changed input capacitance from 2pF to 4pF. 3) Changed UCC27200A input thresholds from 48% and 45% of VDD to 6V and 5.6V to reflect the specification in the Electrical Characteristics table.Go
  • Updated Typical Application section to display a different application diagram and Detailed Design Procedure section since information in legacy data sheet had an outdated circuit with obsolete part numbers. Go
  • Changed application curves to display propagation delay and rise/fall time plots. Go

Changes from Revision A (July 2011) to Revision B (August 2015)

  • Added Negative Voltage Handling on HS (–18 V) to Features List Go
  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from Revision * (February 2011) to Revision A (July 2011)

  • Added SON-10 (DPR) Package to the List of FeaturesGo
  • Added SON-10 (DPR) Package to the DescriptionGo
  • Changed the Pin Functions tableGo
  • Added Additional Pin Functions information.Go