SLUS704C FEBRUARY   2007  – December 2014 UCC27423-EP , UCC27424-EP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Power Dissipation Ratings
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Stage
      2. 7.3.2 Output Stage
      3. 7.3.3 Operational Waveforms and Circuit Layout
      4. 7.3.4 VDD
      5. 7.3.5 Enable
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Source/Sink Capabilities During Miller Plateau
        2. 8.2.2.2 Parallel Outputs
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 Drive Current and Power Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

Table 3. Related Products

PRODUCT DESCRIPTION PACKAGES
UCC37324 Dual 4-A low-side drivers MSOP-8 PowerPAD, SOIC-8, PDIP-8

11.2 Documentation Support

11.2.1 Related Documentation

  1. Power Supply Seminar SEM-1400 Topic 2: Design and Application Guide For High-Speed MOSFET Gate Drive Circuits, by Laszlo Balogh, SLUP133.
  2. Application note, Practical Considerations in High-Performance MOSFET, IGBT, and MCT Gate Drive Circuits, by Bill Andreycak, SLUA105.
  3. Technical brief, PowerPad™ Thermally-Enhanced Package, SLMA002.
  4. Application brief, PowerPad™ Made Easy, SLMA004.

11.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 4. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
UCC27423-EP Click here Click here Click here Click here Click here
UCC27424-EP Click here Click here Click here Click here Click here

11.4 Trademarks

PowerPAD is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.