Home Power management Gate drivers Low-side drivers

UCC27424-EP

ACTIVE

Enhanced Product 4-A/4-A dual-channel gate driver with enable

Product details

Number of channels 2 Power switch IGBT, MOSFET Peak output current (A) 4 Input supply voltage (min) (V) 4.5 Input supply voltage (max) (V) 15 Features Enable pin Operating temperature range (°C) -55 to 125 Rise time (ns) 20 Fall time (ns) 15 Propagation delay time (µs) 0.025 Input negative voltage (V) 0 Rating HiRel Enhanced Product Driver configuration Dual inputs
Number of channels 2 Power switch IGBT, MOSFET Peak output current (A) 4 Input supply voltage (min) (V) 4.5 Input supply voltage (max) (V) 15 Features Enable pin Operating temperature range (°C) -55 to 125 Rise time (ns) 20 Fall time (ns) 15 Propagation delay time (µs) 0.025 Input negative voltage (V) 0 Rating HiRel Enhanced Product Driver configuration Dual inputs
HVSSOP (DGN) 8 14.7 mm² 3 x 4.9
  • Industry-Standard Pinout
  • Enable Functions for Each Driver
  • High Current-Drive Capability of ±4 A
  • Unique Bipolar and CMOS True-Drive Output
    Stage Provides High Current at MOSFET Miller
    Thresholds
  • TTL-/CMOS-Compatible Inputs Independent of
    Supply Voltage
  • 20-ns Typical Rise and 15-ns Typical Fall Times
    With 1.8-nF Load
  • Typical Propagation Delay Times of 25 ns
    With Input Falling and 35 ns With Input Rising
  • 4.5-V to 15-V Supply Voltage
  • Dual Outputs can be Paralleled for Higher Drive
    Current
  • Available in Thermally-Enhanced MSOP
    PowerPAD™ Package With 4.7°C/W RθJC
  • Supports Defense, Aerospace, and Medical
    Applications
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability
  • APPLICATIONS
    • Switch-Mode Power Supplies
    • DC/DC Converters
    • Motor Controllers
    • Line Drivers
    • Class-D Switching Amplifiers

All other trademarks are the property of their respective owners

  • Industry-Standard Pinout
  • Enable Functions for Each Driver
  • High Current-Drive Capability of ±4 A
  • Unique Bipolar and CMOS True-Drive Output
    Stage Provides High Current at MOSFET Miller
    Thresholds
  • TTL-/CMOS-Compatible Inputs Independent of
    Supply Voltage
  • 20-ns Typical Rise and 15-ns Typical Fall Times
    With 1.8-nF Load
  • Typical Propagation Delay Times of 25 ns
    With Input Falling and 35 ns With Input Rising
  • 4.5-V to 15-V Supply Voltage
  • Dual Outputs can be Paralleled for Higher Drive
    Current
  • Available in Thermally-Enhanced MSOP
    PowerPAD™ Package With 4.7°C/W RθJC
  • Supports Defense, Aerospace, and Medical
    Applications
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability
  • APPLICATIONS
    • Switch-Mode Power Supplies
    • DC/DC Converters
    • Motor Controllers
    • Line Drivers
    • Class-D Switching Amplifiers

All other trademarks are the property of their respective owners

The UCC27423 and UCC27424 high-speed MOSFET drivers can deliver large peak currents into capacitive loads. Two standard logic options are offered – dual inverting and dual noninverting drivers. The UCC27424 thermally-enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. The UCC27423 is offered in a standard SOIC-8 (D) package.

Using a design that inherently minimizes shoot-through current, this driver delivers 4 A of current where it is needed most – at the Miller plateau region during the MOSFET switching transition. A unique bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.

The UCC27423 and UCC27424 provide enable (ENB) functions to better control the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8, which previously were left unused in the industry-standard pinout. ENBA and ENBB are pulled up internally to VDD for active-high logic and can be left open for standard operation.

The UCC27423 and UCC27424 high-speed MOSFET drivers can deliver large peak currents into capacitive loads. Two standard logic options are offered – dual inverting and dual noninverting drivers. The UCC27424 thermally-enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. The UCC27423 is offered in a standard SOIC-8 (D) package.

Using a design that inherently minimizes shoot-through current, this driver delivers 4 A of current where it is needed most – at the Miller plateau region during the MOSFET switching transition. A unique bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.

The UCC27423 and UCC27424 provide enable (ENB) functions to better control the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8, which previously were left unused in the industry-standard pinout. ENBA and ENBB are pulled up internally to VDD for active-high logic and can be left open for standard operation.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 11
Type Title Date
* Data sheet UCC2742x-EP Dual 4-A High-Speed Low-Side MOSFET Driver With Enable datasheet (Rev. C) PDF | HTML 23 Dec 2014
* Radiation & reliability report UCC27424MDGNREP Reliability Report 05 Jan 2012
Application note Why use a Gate Drive Transformer? PDF | HTML 04 Mar 2024
Application note Review of Different Power Factor Correction (PFC) Topologies' Gate Driver Needs PDF | HTML 22 Jan 2024
Application note Static Magnet Power Supply Design for Magnetic Resonance Imaging Application PDF | HTML 22 Jan 2024
Application note Benefits of a Compact, Powerful, and Robust Low-Side Gate Driver PDF | HTML 10 Nov 2021
Application brief External Gate Resistor Selection Guide (Rev. A) 28 Feb 2020
Application brief Understanding Peak IOH and IOL Currents (Rev. A) 28 Feb 2020
Application note Improving Efficiency of DC-DC Conversion through Layout 07 May 2019
Application brief How to overcome negative voltage transients on low-side gate drivers' inputs 18 Jan 2019
Application brief High-Side Cutoff Switches for High-Power Automotive Applications (Rev. A) 26 Nov 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation model

UCC27424 PSpice Transient Model

SLUM322.ZIP (40 KB) - PSpice Model
Simulation model

UCC27424 Unencrypted PSpice Transient Model

SLUM508.ZIP (2 KB) - PSpice Model
Calculation tool

SLURB24 UCC2742X Schematic Review Template

Supported products & hardware

Supported products & hardware

Products
Low-side drivers
UCC27423 4-A/4-A dual-channel gate driver with 5-V UVLO, enable, and inverting inputs UCC27423-EP Enhanced Product 4-A/4-A dual-channel gate driver with inverting inputs UCC27423-Q1 Automotive 4-A/4-A dual-channel gate driver with enable and inverting inputs UCC27424 4-A/4-A dual-channel gate driver with enable and 5-V IN handling UCC27424-EP Enhanced Product 4-A/4-A dual-channel gate driver with enable UCC27424-Q1 Automotive 4-A/4-A dual-channel gate driver with enable UCC27425 4-A/4-A dual-channel gate driver with enable and inverting/non-inverting inputs UCC27425-Q1 Automotive 4-A/4-A dual-channel gate driver with inverting/non-inverting inputs
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Package Pins CAD symbols, footprints & 3D models
HVSSOP (DGN) 8 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos