SLUSE26C June   2021  – January 2022 UCC27614

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VDD Undervoltage Lockout
      2. 7.3.2 Input Stage
      3. 7.3.3 Enable Function
      4. 7.3.4 Output Stage
    4. 7.4 Device Functional Modes
  8. 8  Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Driving MOSFET/IGBT/SiC MOSFET
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Input-to-Output Configuration
          2. 8.2.1.2.2 Input Threshold Type
          3. 8.2.1.2.3 VDD Bias Supply Voltage
          4. 8.2.1.2.4 Peak Source and Sink Currents
          5. 8.2.1.2.5 Enable and Disable Function
          6. 8.2.1.2.6 Propagation Delay and Minimum Input Pulse Width
          7. 8.2.1.2.7 Power Dissipation
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Consideration
  11. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.1.3 Application Curves

Many telecom and datacom isolated power modules employ synchronous rectification on the secondary side with center tap topology (as shown in Figure 8-2). The low-side driver UCC27614 can drive these synchronous rectifier MOSFETs as they are referenced to the output ground. These power modules are very power dense and the printed circuit board real estate is at a premium. These power modules may also have very high output current requirements and therefore either need very small Rds(on) MOSFETs or parallel multiple MOSFETs to achieve lower total Rds(on). In either case, the total get charge increases and therefore such applications need a gate driver with high drive current capability. UCC27614DSG fulfills all these requirements. The UCC27614DSG device is used in one such application of a 400-V to 12-V isolated DC-DC converter. Waveforms shown here are captured in this actual application power supply.

Figure 8-2 UCC27614DSG Used to Drive Secondary Side Synchronous Rectifiers
Figure 8-3 UCC27614 Rising (Turn-On) Propagation Delay
GUID-20210228-CA0I-4PQR-MLHV-ZHS2GPTV9RZM-low.gifFigure 8-5 Synchronous Rectifier MOSFET VDS Rising Edge Using UCC27614DSG
GUID-20210228-CA0I-LKFS-R88M-8KQ2W3ZFXTBZ-low.gifFigure 8-7 Input and Output Voltage of Converter Using UCC27614DSG
Figure 8-4 UCC27614 Falling (Turn-Off) Propagation Delay
GUID-20210228-CA0I-KRM5-MZJV-P1XGFKS9QKHR-low.gifFigure 8-6 Synchronous Rectifier MOSFET VDS Falling Edge Using UCC27614DSG
GUID-20210228-CA0I-9J1Z-PHXR-9XRXMP9VB6H6-low.gifFigure 8-8 Output Voltage and Current of a Converter Using UCC27634DSG