SLUS492K June   2001  – November 2023 UCC27323 , UCC27324 , UCC27325 , UCC37323 , UCC37324 , UCC37325

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Stage
      2. 7.3.2 Output Stage
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Source/Sink Capabilities During Miller Plateau
        2. 8.2.2.2 Parallel Outputs
        3. 8.2.2.3 VDD
        4. 8.2.2.4 Driver Current and Power Requirements
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Device Comparison Table

OUTPUT CONFIGURATION TEMPERATURE
RANGE
TA = TJ		 PACKAGED DEVICES(1)
SOIC-8 (D) MSOP-8 PowerPAD (DGN)(2) PDIP-8 (P)
Dual inverting –40°C to +125°C UCC27323D UCC27323DGN UCC27323P
0°C to +70°C UCC37323D UCC37323DGN UCC37323P
Dual noninverting –40°C to +125°C UCC27324D UCC27324DGN UCC27324P
0°C to +70°C UCC37324D UCC37324DGN UCC37324P
One inverting, one noninverting –40°C to +125°C UCC27325D UCC27325DGN UCC27325P
0°C to +70°C UCC37325D UCC37325DGN UCC37325P
(1) D (SOIC-8) and DGN (PowerPAD-MSOP) packages are available taped and reeled. Add R suffix to device type (for example UCC27323DR, UCC27324DGNR) to order quantities of 2,500 devices per reel for D or 1,000 devices per reel for DGN package.
(2) The PowerPAD is not directly connected to any leads of the package. However, the PowerPAD is electrically and thermally connected to the substrate which is the ground of the device.