UCC27324
- Bi-CMOS Output Architecture
- ±4 A Drive Current at the Miller Plateau Region
- Constant-Current Even at Low Supply Voltages
- Outputs Paralleled for Higher Drive Current
- Available in MSOP- PowerPAD™ Package
- TTL/CMOS Inputs Independent of Supply Voltage
- Industry-Standard Pin-Out
The UCC2732x and UCC3732x family of high-speed dual-MOSFET Drivers deliver 4-A source and 4-A sink peak current to effectively drive MOSFETs where it is needed most at the Miller Plateau Region. A unique BiPolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages. Three standard logic options are offered — dual-inverting, dual-noninverting, and one-inverting and one-noninverting driver. Input thresholds are based on TTL and CMOS and independent of supply voltage and feature wide input hysteresis offering excellent noise immunity. The UCC2732x and UCC3732x family is available in the standard SOIC-8 (D) as well as the thermally enhanced -8pin PowerPAD MSOP package (DGN), drastically lowering thermal resistance to improve long term reliability.
Similar products you might be interested in
Pin-for-pin with same functionality to the compared device
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
UCC27423-4-5-Q1EVM — UCC2742xQ1 Dual 4-A High-Speed Low-Side MOSFET Drivers With Enable Evaluation Module (EVM)
UCC3895EVM-001 — UCC3895 Evaluation Module
The UCC3895EVM-001 is an isolated 48V input phase shifted full bridge converter providing an output of 3.3V at 15A. Using the AB outputs of the UCC3895, a novel technique for direct control driven synchronous rectification is demonstrated.
UCCx895 and UCCx7324 Families PSpice Transient Model (Rev. A)
SLURB26 — UCC2732X and UCC3732X Schematic Review Template
Supported products & hardware
Products
Low-side drivers
PSPICE-FOR-TI — PSpice® for TI design and simulation tool
Many TI reference designs include the UCC27324
Use our reference design selection tool to review and identify designs that best match your application and parameters.
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
HVSSOP (DGN) | 8 | Ultra Librarian |
PDIP (P) | 8 | Ultra Librarian |
SOIC (D) | 8 | Ultra Librarian |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.