SLLSER8J June 2017 – August 2024 UCC5310 , UCC5320 , UCC5350 , UCC5390
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | UCC53x0 | UNIT | ||
---|---|---|---|---|
D (SOIC) | DWV (SOIC) | |||
8 PINS | 8 PINS | |||
RθJA | Junction–to-ambient thermal resistance | 109.5 | 119.8 | °C/W |
RθJC(top) | Junction–to-case (top) thermal resistance | 43.1 | 64.1 | °C/W |
RθJB | Junction–to-board thermal resistance | 51.2 | 65.4 | °C/W |
ΨJT | Junction–to-top characterization parameter | 18.3 | 37.6 | °C/W |
ΨJB | Junction–to-board characterization parameter | 50.7 | 63.7 | °C/W |