SLUSG03 December   2024 UCC57102Z-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Stage
      2. 6.3.2 Driver Stage
      3. 6.3.3 Desaturation (DESAT) Protection
      4. 6.3.4 Fault (FLT)
      5. 6.3.5 VREF
      6. 6.3.6 Thermal Shutdown
    4. 6.4 Device Functional Modes
  8. 7  Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 VDD Undervoltage Lockout
      3. 7.2.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

All the voltages are with respect to GND. Over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
VDD-GNDPositive power supply–0.330V
VDD-VEEDifferential Power Supply-0.330V
VEE-GND Negative Power Supply-180.3V
OUTOutput signal DC voltageGND/VEE–0.3                VDD+0.3V
Output signal transient voltage for 200-nsGND/VEE–2               VDD+3V
VDESATDesat voltage–0.3           VDD+0.3V
VININ signal DC voltage–530V
VENEN signal DC voltage (W Version)–530V
IFLTFLT current sink 20mA
VFLTExternal pull-up -0.3VDD+0.3V
TJJunction temperature–40150℃
TstgStorage temperature–65150℃
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.