5 Revision History
Changes from Revision I (January 2017) to Revision J (November 2021)
- Change sync feature description to say it works with all UCD3138
family members instead of just UCD3138064. Split Device Overview section into 4
sections to conform to TI data sheet standards. Go
- Change number of ADC channels to 15 since there are 14 external
channels and 1 channel for the internal temperature sensorGo
- update Product Family Comparison to show full UCD family Go
- Added mention of debugging capability to the JTAG pin descriptions
and added note that the RMH package is not recommended for new
designsGo
- Added DAC Output as an alternative pin out for pins 2, 3, and
4.Go
- Correct location of PMBus/SMBus/I2C rise and fall time test
conditions Table 8-1
Go
- Added "using the EADCs as a source" to the digital comparator description Go
- Replaced the Power Suppply and
Layout Guidelines Section with the Power Supply Recommendations Section and Layout
Section. The new content is copied directly from the UCD3138 Family Practical Design
Guideline Application Note. Go
- Updated FUSION_DIGITAL_POWER_STUDIO URLs. Moved all CCS references
to the Code Composer Studio section and updated them. Also updated the list of
documents.Go
- Changed References section Go
Changes from Revision H (October 2016) to Revision I (January 2017)
- Added updated Layout Guidelines section and added Layout Example
imagesGo
Changes from Revision G (September 2016) to Revision H (October 2016)
- Added PACKAGE DRAWING column to the Device Information table. Go
- Changed Note 2 from "Recommended for new 40-pin designs with advance
BLR performance" to "Recommended for new 40-pin designs, optimized for improved
performance under temperature cycling test for board level reliability (BLR)." Go
- Deleted Figure 7-3 note, "These features help to improve solder-joint reliability". Go
Changes from Revision F (November 2013) to Revision G (September 2016)
- Added Device and Documentation Support section and ESD
Ratings table.Go
- Changed document flow to match UCD3138A.Go
- Added RJA package to Features and the Device
Information table. Go
- Added RJA package. Go
- Added the RJA package to the Thermal Information table.Go
Changes from Revision E (August 2013) to Revision F (November 2013)
- Changed Top Side Marking info from " 3138 " to " 3138RMH " in the
Ordering Information table. Go
Changes from Revision D (August 2013) to Revision E (August 2013)
- Added UCD3138RMH to Feature bulletGo
- Added RMH package pinout drawingGo
- Added RMH package thermal specificationsGo
- Changed Global I/O registers ordered list, item 5 text from "Connecting pin/pins to high rail through internal pull up resistors." to "Configuring pin/pins as open drain or push-pull (Normal)"Go
Changes from Revision C (March 2013) to Revision D (August 2013)
- Changed TOPT spec to TJ in Abs Max table with MAX temp of 150°CGo
- Added BP18 Voltage vs Temperature graphicGo
Changes from Revision B (July 2012) to Revision C (March 2013)
- Deleted "JTAG Debug Port" feature bulletGo
- Deleted text string "JTAG debug" from Description
section.Go
- Added NOTE under Functional Block DiagramGo
- Deleted "JTAG" option from Product Selection Matrix.Go
- Added text to Pin 54 descriptionGo
- Added text to Pin 35 descriptionGo
- Added BP18 spec to Abs Max Ratings and Recommended Operating Conditions TablesGo
- Deleted VDD specification from System Performance section of Electrical Characteristics
Go
- Added footnote to Table 8-1
Go
- Added text string regarding front-end 2 in the Front End section Go
- Deleted text string reference to "JTAG port" in ARM Processor sectionGo
- Changed text strings in
Section 13.1.2
Go
- Added document to References listGo
Changes from Revision A (March 2012) to Revision B (July 2012)
- Added Feature bulletsGo
- Changed "Dual Edge Modulation" to "Triangular Modulation" in Features sectionGo
- Changed "265 ksps" to "267 ksps" in Features section Go
- Clarified number of UARTs in Feature sectionGo
- Changed "FDPP" to "DDP" throughout.Go
- Changed "FDPP" to "DDP" throughout.Go
- Changed Total GPIO pin count for the UCD3138 40-pin device from "17" to "18" in the Product Selection Matrix table.Go
- Changed "VREG" to "BP18" in conditions statement for Electrical Characteristics
Go
- Changed EAP – EAN Error voltage digital resolution MIN values for AFE = 3, AFE = 2, AFE = 1, AFE = 0 from 0.95, 1.90, 3.72, and 7.3 respectively; to, 0.8, 1.7, 3.55, and 6.90 respectively.Go
- Changed conditions for VOL and VOH specifications in Electrical Characteristics
Go
- Added TWD specification to Electrical Characteristics
Go
- Changed "PWM" to "DPWM" in
Section 8.8.1.2
Go
- Changed waveforms graphic for "Phase Shifted Full Bridge Example" for clarification Go
- Added text to section
Section 9.5.2.2
Go
- Changed typical conversion speed from "268 ksps" to "267 ksps" in the General Purpose ADC12 section.Go
- Added package ID information for the UCD3138RGC and UCD3138RHA devices.Go
- Added bullet "AD02 has a special ESD protection mechanism that prevents the pin from pulling down the current-share bus if power is missing from the UCD3138" to
Section 9.5.12
.Go
- Changed "PWMA" and "PWMB" to "DPWMA" and "DPWMB" in Section 9.6.1. Go
- Changed " Mechanical Data" section to "References" sectionGo
Changes from Revision * (March 2012) to Revision A (March 2012)
- Added Production Data statement to footnote and removed "Product Preview" bannerGo