SLUSC66E March   2015  – February 2017 UCD3138A

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2 Device Comparison
    1. 2.1 Product Selection Matrix
  3. 3 Pin Configuration and Functions
    1. 3.1 UCD3138A RGC Package
    2. 3.2 UCD3138A RMH Package
    3. 3.3 UCD3138A RJA Package
  4. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 PMBus/SMBus/I2C Timing
    7. 4.7 Peripherals
      1. 4.7.1 Digital Power Peripherals (DPPs)
        1. 4.7.1.1 Front End
        2. 4.7.1.2 DPWM Module
        3. 4.7.1.3 DPWM Events
        4. 4.7.1.4 High Resolution DPWM
        5. 4.7.1.5 Oversampling
        6. 4.7.1.6 DPWM Interrupt Generation
        7. 4.7.1.7 DPWM Interrupt Scaling/Range
        8. 4.7.1.8 DPWM Synchronization
        9. 4.7.1.9 Synchronous Rectifier Dead-Time Optimization Peripheral
    8. 4.8 Typical Temperature Characteristics
  5. 5 Parametric Measurements Information
    1. 5.1 Power-On Reset (POR) and Brown-Out Reset (BOR)
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 ARM Processor
    3. 6.3 Memory
      1. 6.3.1 CPU Memory Map and interruptions
      2. 6.3.2 Boot ROM
      3. 6.3.3 Customer Boot Program
      4. 6.3.4 Flash Management
    4. 6.4 System Module
      1. 6.4.1 Address Decoder (DEC)
      2. 6.4.2 Memory Management Controller (MMC)
      3. 6.4.3 System Management (SYS)
      4. 6.4.4 Central Interrupt Module (CIM)
    5. 6.5 Feature Description
      1. 6.5.1  Sync FET Ramp and IDE Calculation
      2. 6.5.2  Automatic Mode Switching
        1. 6.5.2.1 Phase Shifted Full Bridge Example
        2. 6.5.2.2 LLC Example
        3. 6.5.2.3 Mechanism for Automatic Mode Switching
      3. 6.5.3  DPWMC, Edge Generation, IntraMux
      4. 6.5.4  Filter
        1. 6.5.4.1 Loop Multiplexer
        2. 6.5.4.2 Fault Multiplexer
      5. 6.5.5  Communication Ports
        1. 6.5.5.1 SCI (UART) Serial Communication Interface
        2. 6.5.5.2 PMBus Interfacte
        3. 6.5.5.3 General Purpose ADC12
        4. 6.5.5.4 Timers
          1. 6.5.5.4.1 24-bit PWM Timer
          2. 6.5.5.4.2 16-Bit PWM Timers
          3. 6.5.5.4.3 Watchdog Timer
      6. 6.5.6  Miscellaneous Analog
      7. 6.5.7  Package ID Information
      8. 6.5.8  Brownout
      9. 6.5.9  Global I/O
      10. 6.5.10 Temperature Sensor Control
      11. 6.5.11 I/O Mux Control
      12. 6.5.12 Current Sharing Control
      13. 6.5.13 Temperature Reference
  7. 7 Device Functional Modes
    1. 7.1 Normal Mode
    2. 7.2 DPWM Multiple Output Mode
    3. 7.3 DPWM Resonant Mode
    4. 7.4 Triangular Mode
    5. 7.5 Leading Edge Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 PCMC (Peak Current Mode Control) PSFB (Phase-Shifted Full Bridge) Hardware Configuration Overview
        2. 8.2.2.2 DPWM Initialization for PSFB
      3. 8.2.3 Fixed Signals to Bridge
      4. 8.2.4 Dynamic Signals to Bridge
      5. 8.2.5 System Initialization for PCM
        1. 8.2.5.1 Use of Front Ends and Filters in PSFB
        2. 8.2.5.2 Peak Current Detection
        3. 8.2.5.3 Peak Current Mode (PCM)
      6. 8.2.6 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Decoupling and Bulk Capacitors
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Tools and Documentation
    2. 11.2 Documentation Support
      1. 11.2.1 References
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical Packaging and Orderable Information
    1. 12.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical Packaging and Orderable Information

12.1 Packaging Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.