SLUS652E March   2005  – April 2020 UCD8220

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 UCD8220 Typical Simplified Push-Pull Converter Application Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 CLK Input Time-Domain Digital Pulse Train
      2. 7.3.2 Current Sensing and Protection
      3. 7.3.3 Handshaking
      4. 7.3.4 Driver Output
      5. 7.3.5 Source and Sink Capabilities During Miller Plateau
      6. 7.3.6 Drive Current and Power Requirements
      7. 7.3.7 Clearing the Current-Limit Flag (CLF)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Selecting the ISET Resistor for Voltage Mode Control
        2. 8.2.2.2 Selecting the ISET Resistor for Voltage Mode Control with Voltage Feed Forward
        3. 8.2.2.3 Selecting the ISET Resistor for Peak Current Mode Control with Internal Slope Compensation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PWP|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings(1)(2)

MIN MAX UNIT
Supply voltage, VDD 16 V
Supply current, IDD Quiescent 20 mA
Switching, TA = 25°C, TJ = 105°C, VDD = 12 V 200
Output gate-drive voltage, VO OUTx –1 PVDD V
Output gate-drive sink current, IO(sink) OUTx 4 A
Output gate-drive source current, IO(source) OUTx –4
Analog input ISET, CS, CTRL, ILIM –0.3 3.6 V
Digital I/Os CLK, CLF –0.3 3.6
Continuous total power dissipation See Thermal Information
Operating junction temperature range, TJ –55 150 °C
Lead temperature (Soldering, 10 sec) 300 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal.