SLUSFF2 October   2024 UCG28826

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Detailed Pin Descriptions
      1. 6.3.1  HV - High Voltage Input
      2. 6.3.2  SW - Switch Node
      3. 6.3.3  GND – Ground Return
      4. 6.3.4  FLT - External Overtemperature Fault
      5. 6.3.5  FB ­­– Feedback
      6. 6.3.6  TR - Turns Ratio
      7. 6.3.7  IPK - Peak Current and Dithering
      8. 6.3.8  FCL - Frequency clamp and fault response
      9. 6.3.9  CDX - CCM, drive strength and X-cap discharge
      10. 6.3.10 VCC - Input Bias
    4. 6.4 Feature Description
      1. 6.4.1  Self Bias and Auxless Sensing
      2. 6.4.2  Control Law
        1. 6.4.2.1 Valley Switching
        2. 6.4.2.2 Frequency Foldback
        3. 6.4.2.3 Burst Mode
        4. 6.4.2.4 Continuous Conduction Mode (CCM)
      3. 6.4.3  GaN HEMT Switching Capability
      4. 6.4.4  Soft Start
      5. 6.4.5  Frequency Clamp
      6. 6.4.6  Frequency Dithering
      7. 6.4.7  Slew Rate Control
      8. 6.4.8  Transient Peak Power Capability
      9. 6.4.9  X-Cap Discharge
      10. 6.4.10 Fault Protections
        1. 6.4.10.1 Brownout Protection
        2. 6.4.10.2 Short-Circuit Protection
        3. 6.4.10.3 Output Over Voltage Protection
        4. 6.4.10.4 Over Power Protection (OPP, LPS)
        5. 6.4.10.5 Overtemperature Protection
        6. 6.4.10.6 Open FB Protection
        7. 6.4.10.7 Error Codes for Protections
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Bulk Capacitor
        2. 7.2.2.2 Transformer Primary Inductance and Turns Ratio
        3. 7.2.2.3 Output Capacitor
        4. 7.2.2.4 Selection Resistors
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum
    2. 10.2 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
  • REZ|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (all pins except HV and SW pins) (1) ±2000 V
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (HV and SW pins) (1) ±1000
Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002 (2) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.