SWRS152N June 2013 – April 2021 WL1801MOD , WL1805MOD , WL1831MOD , WL1835MOD
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
The TI module uses µvias for layers 1 through 6 with full copper filling, providing heat flow all the way to the module ground pads.
TI recommends using one big ground pad under the module with vias all the way to connect the pad to all ground layers (see Figure 10-4).
Figure 10-5 shows via array patterns, which are applied wherever possible to connect all of the layers to the TI module central or main ground pads.