SWRS152N June 2013 – April 2021 WL1801MOD , WL1805MOD , WL1831MOD , WL1835MOD
PRODUCTION DATA
- 1 Features
- 2 Applications
- 3 Description
- 4 Functional Block Diagram
- 5 Revision History
- 6 Device Comparison
- 7 Terminal Configuration and Functions
-
8 Specifications
- 8.1 Absolute Maximum Ratings
- 8.2 ESD Ratings
- 8.3 Recommended Operating Conditions
- 8.4 External Digital Slow Clock Requirements
- 8.5 Thermal Resistance Characteristics for MOC 100-Pin Package
- 8.6 WLAN Performance: 2.4-GHz Receiver Characteristics
- 8.7 WLAN Performance: 2.4-GHz Transmitter Power
- 8.8 WLAN Performance: Currents
- 8.9 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
- 8.10 Bluetooth Performance: Transmitter, BR
- 8.11 Bluetooth Performance: Transmitter, EDR
- 8.12 Bluetooth Performance: Modulation, BR
- 8.13 Bluetooth Performance: Modulation, EDR
- 8.14 Bluetooth low energy Performance: Receiver Characteristics – In-Band Signals
- 8.15 Bluetooth low energy Performance: Transmitter Characteristics
- 8.16 Bluetooth low energy Performance: Modulation Characteristics
- 8.17 Bluetooth BR and EDR Dynamic Currents
- 8.18 Bluetooth low energy Currents
- 8.19
Timing and Switching Characteristics
- 8.19.1 Power Management
- 8.19.2 Power-Up and Shut-Down States
- 8.19.3 Chip Top-level Power-Up Sequence
- 8.19.4 WLAN Power-Up Sequence
- 8.19.5 Bluetooth-Bluetooth low energy Power-Up Sequence
- 8.19.6 WLAN SDIO Transport Layer
- 8.19.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
- 8.19.8 Bluetooth Codec-PCM (Audio) Timing Specifications
- 9 Detailed Description
- 10Applications, Implementation, and Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
Package Options
Refer to the PDF data sheet for device specific package drawings
Mechanical Data (Package|Pins)
- MOC|100
Thermal pad, mechanical data (Package|Pins)
Orderable Information
12.1 TI Module Mechanical Outline
Figure 12-1 shows the mechanical outline for the device.
Figure 12-1 TI Module Mechanical Outline
Table 12-1 lists the dimensions for the mechanical outline of the device.
Note:
The TI module weighs 0.684 g typical.
Table 12-1 Dimensions for TI Module Mechanical Outline
| MARKING | MIN (mm) | NOM (mm) | MAX (mm) | MARKING | MIN (mm) | NOM (mm) | MAX (mm) | |
|---|---|---|---|---|---|---|---|---|
| L (body size) | 13.20 | 13.30 | 13.40 | c2 | 0.65 | 0.75 | 0.85 | |
| W (body size) | 13.30 | 13.40 | 13.50 | c3 | 1.15 | 1.25 | 1.35 | |
| T (thickness) | 1.80 | 1.90 | 2.00 | d1 | 0.90 | 1.00 | 1.10 | |
| a1 | 0.30 | 0.40 | 0.50 | d2 | 0.90 | 1.00 | 1.10 | |
| a2 | 0.60 | 0.70 | 0.80 | e1 | 1.30 | 1.40 | 1.50 | |
| a3 | 0.65 | 0.75 | 0.85 | e2 | 1.30 | 1.40 | 1.50 | |
| b1 | 0.20 | 0.30 | 0.40 | e3 | 1.15 | 1.25 | 1.35 | |
| b2 | 0.65 | 0.75 | 0.85 | e4 | 1.20 | 1.30 | 1.40 | |
| b3 | 1.20 | 1.30 | 1.40 | e5 | 1.00 | 1.10 | 1.20 | |
| c1 | 0.20 | 0.30 | 0.40 | e6 | 1.00 | 1.10 | 1.20 |