SBOS375D October   2006  – October 2024 XTR111

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Explanation of Pin Functions
      2. 6.3.2 Dynamic Performance
      3. 6.3.3 External Current Limit
      4. 6.3.4 External MOSFET
      5. 6.3.5 Output Error Flag and Disable Input
      6. 6.3.6 Voltage Regulator
      7. 6.3.7 Level Shift of 0V Input and Transconductance Trim
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input Voltage
      2. 7.1.2 Error Flag Delay
      3. 7.1.3 Voltage Output Configuration
      4. 7.1.4 4mA-to-20mA Output
    2. 7.2 Typical Applications
      1. 7.2.1 0mA–20mA Voltage-to-Current Converter
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Additional Applications
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Package and Heat Dissipation
        2. 7.4.1.2 Thermal Pad Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DRC|10
  • DGQ|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2.1.2 Detailed Design Procedure

The DAC60501 was selected because the DAC has 12-bit resolution, can be powered using a 5V supply, and has a 0-5V output range with a 5V supply. The DAC7551 can be used in place of the DAC60501 if desired. Pin 1 of the XTR111 is connected to the +24V supply rail, and instead of using a separate 5V supply line for the DAC, this application uses the voltage regulator built in to the XTR111 configured for 5V using R1 and R2. In this case, R1 is 2kΩ and R2 is 3kΩ, resulting in a VREGF of 5V. To improve the stability of the voltage regulator, C2 needs to be 470nF or larger. In this application, a 470nF capacitor was selected. For more details on configuring the voltage regulator, see Section 6.3.6.

The error flag logic output (EF) is not used in this application and can be left unconnected. To keep the output of the XTR111 enabled, the output disable pin (OD) needs to be connected to GND. For additional information on the output disable and output error flag pins, see Section 6.3.5.

For a 5V full-scale input signal corresponding to an output current of 20mA, RSET was set to 2.5kΩ.

To create the external current limit, the Infineon BSP170P and Onsemi MMBT2907A were chosen as the external transistors. For additional examples of P-Channel MOSFETs, see Table 6-1. To limit the current output of the IS pin, R6 was set to 15Ω. R7 and C3 were added for additional output filtering. For more information on the external current limit and selecting external transistors, see Section 6.3.3.