SBOS375D October   2006  – October 2024 XTR111

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Explanation of Pin Functions
      2. 6.3.2 Dynamic Performance
      3. 6.3.3 External Current Limit
      4. 6.3.4 External MOSFET
      5. 6.3.5 Output Error Flag and Disable Input
      6. 6.3.6 Voltage Regulator
      7. 6.3.7 Level Shift of 0V Input and Transconductance Trim
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input Voltage
      2. 7.1.2 Error Flag Delay
      3. 7.1.3 Voltage Output Configuration
      4. 7.1.4 4mA-to-20mA Output
    2. 7.2 Typical Applications
      1. 7.2.1 0mA–20mA Voltage-to-Current Converter
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Additional Applications
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Package and Heat Dissipation
        2. 7.4.1.2 Thermal Pad Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DRC|10
  • DGQ|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision C (June 2011) to Revision D (October 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added the Specifications, ESD Ratings, Recommended Operating Conditions, Thermal Information, Detailed Description, Overview, Functional Block Diagram, Feature Description, Device Functional Modes, Application and Implementation, Typical Applications, Power Supply Recommendations, Layout, Layout Example, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Changed maximum output current from 36mA to 32mA in Description.Go
  • Moved maximum current specification for IS from table note to table row.Go
  • Added charged device model (CDM) ESD specification of ±1000V to ESD Ratings.Go
  • Changed Specified output current (derated performance) maximum from 36mA to 32mA in Electrical Characteristics Go
  • Changed Current limit for output current from 42 ±6mA to 41 ±9mA in Electrical Characteristics Go
  • Changed Nonlinearity, IOUT/ISET test condition from "0.1mA to 36mA" to "0.1mA to 32mA" in Electrical Characteristics Go
  • Deleted redundant specified and operating temperature, specified and operating voltage, and package thermal impedance from Electrical Characteristics.Go
  • Changed maximum current specification from 36mA to 32mA in Overview.Go
  • Updated Table 6-1, P-Channel MOSFET (Examples) Go
  • Added Error Flag Delay section to Application Information Go
  • Changed from DAC7551 to DAC60501Go
  • Added Power Supply Recommendations Go
  • Added additional guidance on heat dissipation in Package and Heat Dissipation Go

Changes from Revision B (June, 2010) to Revision C (June, 2011)

  • Updated wiring error in Figure 46, Current Using a 0V to 5V Input From the DAC7551, a 12‑Bit Digital-to-Analog Converter Go

Changes from Revision A (August 2007) to Revision B (June 2010)