SBOS375D October   2006  – October 2024 XTR111

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Explanation of Pin Functions
      2. 6.3.2 Dynamic Performance
      3. 6.3.3 External Current Limit
      4. 6.3.4 External MOSFET
      5. 6.3.5 Output Error Flag and Disable Input
      6. 6.3.6 Voltage Regulator
      7. 6.3.7 Level Shift of 0V Input and Transconductance Trim
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input Voltage
      2. 7.1.2 Error Flag Delay
      3. 7.1.3 Voltage Output Configuration
      4. 7.1.4 4mA-to-20mA Output
    2. 7.2 Typical Applications
      1. 7.2.1 0mA–20mA Voltage-to-Current Converter
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Additional Applications
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Package and Heat Dissipation
        2. 7.4.1.2 Thermal Pad Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DRC|10
  • DGQ|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1.1 Input Voltage

The input voltage range for a given output current span is set by RSET according to the transfer function. Select a precise and low-drift resistor for best performance because resistor drift directly converts into drift of the output current. Careful layout must also minimize any series resistance with RSET and the VIN reference point.

The input voltage is referred to the grounding point of RSET. Therefore, this point must not be distorted from other currents. Assuming a 5V full-scale input signal for a 20mA output current, RSET is 2.5kΩ. A resistance uncertainty of just 2.5Ω already degrades the accuracy to below 0.1%.

The linear input voltage range extends from 0V to 12V, or 2.3V less than the positive supply voltage (whichever is smaller). The lowest rated supply voltage accommodates an input voltage range of up to 5V. Potential clipping is not detected by an error signal; therefore, safe design guard banding is recommended.

Do not drive the input negative (referred to GND) greater than 300mV. Higher negative voltages turn on the internal protection diodes. Insert a resistor in series with the input if negative signals can occur eventually during power on or power off, or during other transient conditions. Select a resistor value that limits the possible current to 0.3mA. Higher currents are nondestructive (see Absolute Maximum Ratings), but can produce output current glitches unless in disable mode.

More protection against negative input signals is provided using a standard diode and a 2.2kΩ resistor, as shown in Figure 7-1.

XTR111 Enhanced Protection Against Negative Overload of VIN Figure 7-1 Enhanced Protection Against Negative Overload of VIN