SBOS344E September   2005  – January 2026 XTR117

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Reverse-Voltage Protection
      2. 7.3.2 Overvoltage Surge Protection
      3. 7.3.3 VSON Package
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 External Transistor
      2. 8.1.2 Minimum Output Current
      3. 8.1.3 Offsetting the Input
      4. 8.1.4 Radio Frequency Interference
      5. 8.1.5 Maximum Output Current
      6. 8.1.6 Circuit Stability
    2. 8.2 Typical Application
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGK|8
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1.6 Circuit Stability

The 4-20mA control-loop stability must be evaluated for any XTR117 design. A 10nF decoupling capacitor between V+ and IO is recommended for most applications. As this capacitance appears in parallel with the load resistance RLOAD from a stability perspective, the capacitor and resistor form a filter corner that can limit the bandwidth of the system. Therefore, for HART applications, use a bypass capacitance of 2nF to 3nF instead.

For applications with EMI and EMC concerns, use a bypass capacitor with sufficiently low ESR to decouple any ripple voltage from the VLOOP supply. Otherwise, the ripple voltage couples onto the 4mA to 20mA current source, and appears as noise across RLOAD after the current-to-voltage conversion.