SBOS344D September 2005 – November 2023 XTR117
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
The XTR117 is offered in a VSON-8 package (also known as SON or DFN). The VSON is a QFN package with lead contacts on only two sides of the bottom of the package. This leadless package maximizes board space and enhances thermal and electrical characteristics through an exposed pad.
VSON packages are physically small, have a smaller routing area, improved thermal performance, and improved electrical parasitics. Additionally, the absence of external leads eliminates bent-lead issues.
The VSON package can be easily mounted using standard printed circuit board (PCB) assembly techniques. See the QFN/SON PCB Attachment and Quad Flatpack No-Lead Logic Packages application notes, both available for download at www.ti.com.
Connect the exposed leadframe die pad on the bottom of the package to IRET or leave unconnected.