SBOS344D September   2005  – November 2023 XTR117

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings #GUID-A1BA2296-600A-4764-BBF1-62E55FF362E3/GUID-7F491310-4E37-4E2F-922E-35EFD7CCE84F
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Reverse-Voltage Protection
      2. 6.3.2 Overvoltage Surge Protection
      3. 6.3.3 VSON Package
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 External Transistor
      2. 7.1.2 Minimum Output Current
      3. 7.1.3 Offsetting the Input
      4. 7.1.4 Radio Frequency Interference
      5. 7.1.5 Maximum Output Current
      6. 7.1.6 Circuit Stability
    2. 7.2 Typical Application
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGK|8
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) XTR117 UNIT
DGK (VSSOP) DRB (VSON)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 173.9 60.7 °C/W
RθJB Junction-to-board thermal resistance 95.2 33.2 °C/W
ψJT Junction-to-top characterization parameter 11.1 4.7 °C/W
ψJB Junction-to-board characterization parameter 93.7 33.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 66.3 70.4 °C/W
RθJC(top) Junction-to-case (bottom) thermal resistance N/A 17.8 °C/W
(1) For information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.