SBOS913 February   2018 XTR305

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Voltage Output Mode
    6. 6.6  Electrical Characteristics: Current Output Mode
    7. 6.7  Electrical Characteristics: Operational Amplifier (OPA)
    8. 6.8  Electrical Characteristics: Instrumentation Amplifier (IA)
    9. 6.9  Electrical Characteristics: Current Monitor
    10. 6.10 Electrical Characteristics: Power and Digital
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Functional Features
      2. 7.3.2 Current Monitor
      3. 7.3.3 Error Flags
      4. 7.3.4 Power On/Off Glitch
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Voltage Output Mode
        2. 8.2.2.2  Current Output Mode
        3. 8.2.2.3  Input Signal Connection
        4. 8.2.2.4  Externally-Configured Mode: OPA and IA
        5. 8.2.2.5  Driver Output Disable
        6. 8.2.2.6  Driving Capacitive Loads and Loop Compensation
        7. 8.2.2.7  Internal Current Sources, Switching Noise, and Settling Time
        8. 8.2.2.8  IA Structure, Voltage Monitor
        9. 8.2.2.9  Digital I/O and Ground Considerations
        10. 8.2.2.10 Output Protection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 VQFN Package and Heat Sinking
    4. 10.4 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

Supply bypass capacitors must be close to the package and connected with low-impedance conductors. Avoid noise coupled into RGAIN, and observe wiring resistance. For thermal management, see the VQFN Package and Heat Sinking section.

Layout for the XTR305 is not critical; however, its internal current chopping works best with good (low dynamic impedance) supply decoupling. Therefore, avoid through-hole contacts in the connection to the bypass capacitors or use multiple through-hole contacts. Switching noise from power supplies should be filtered enough to reduce influence on the circuit. Small resistors (2-Ω, for example) or damping inductors in series with the supply connection (between the DC-DC converter and the XTR circuit) act as a decoupling filter together with the bypass capacitor as shown in Figure 49.

Resistors connected close to the input pins help dampen environmental noise coupled into conductor traces. Therefore, place the OPA input- and IA input-related resistors close to the package. Also, avoid additional wire resistance in series to RSET, ROS, and RGAIN (observe the reliability of the through-hole contacts), because this resistance could produce gain and offset error as well as drift; 1 Ω is already 0.1% of the 1-kΩ resistor.

The exposed lead-frame die pad on the bottom of the package must be connected to V−, pin 11 (see the VQFN Package and Heat Sinking section for more details).

XTR305 ai_supply_decoupl_bos336.gifFigure 49. Suggested Supply Decoupling for Noisy Chopper-Type Supplies